QFN (quad flat non-lead) package with multiple circles of pins and manufacturing method thereof

Abstract

The invention discloses a QFN (quad flat non-lead) package with multiple circles of pins and a manufacturing method thereof. The package comprises a lead frame, metal material layers, an IC (integrated circuit) chip, an insulated filling material, an adhesive material, metal conductors and a plastic package material, wherein the lead frame comprises a chip carrier and multiple pins which are arranged around the chip carrier for multiple circles; the metal material layers are arranged on the upper surface and lower surface of the lead frame; the IC chip is arranged on the metal material layer on the upper surface of the lead frame; the insulated filling material is arranged below a stepped structure of the lead frame; the adhesive material is arranged between the IC chip and the metal material layer on the upper surface of the lead frame; the IC chip is respectively connected with inner pins of the multiple circles of pins and the upper surface of the chip carrier by the metal conductors; and the plastic package material coats and seals the IC chip, the adhesive material, the metal conductors, parts of regions of the lead frame and parts of metal material layer. According to the invention, the bottleneck of the low I / O (input / output) quantity can be broken through, and the sealing reliability is improved.

Description

technical field [0001] The invention relates to the technical field of manufacturing semiconductor components, in particular to a quadrilateral flat leadless package with multi-circle pin arrangement, and the invention also includes a manufacturing method of the package. Background technique [0002] With the development of electronic products such as mobile phones and notebook computers towards miniaturization, portability, ultra-thinness, multimedia and low-cost requirements for popularization, high-density, high-performance, high-reliability and low-cost packaging forms and Its assembly technology has been developed rapidly. Compared with expensive BGA and other packaging forms, the new packaging technology that has developed rapidly in recent years, that is, the quad flat non-lead QFN (QuadFlatNon-leadPackage) package, has good thermal and electrical properties, small size, low cost and Many advantages such as high productivity have triggered a new revolution in the fie...

AI Technical Summary

Problems solved by technology

[0004] With the improvement of IC integration and the continuous enhancement of functions, the number of I / Os of ICs increases, and the number of I / O pins of corresponding electronic packages also increases accordingly. The pins of the ring are arranged around the chip carrier, which limits the increase in the number of I / Os and cannot meet the needs of high-density ICs with more I / Os.

The traditional lead frame has no step structure design, which cannot effectively lock the plastic material, resulting in low bonding strength between the lead frame and the plastic packaging material, which is easy to cause delamination of the lead frame and the plastic packaging material or even the falling off of the pin or chip carrier, and cannot effectively Prevent moisture from diffusing into the electronic package along the interface between the lead frame and the plastic packaging material, which seriously affects the reliability of the package

Traditional QFN products need to paste tape on the back of the lead frame in advance to prevent overflow during the plastic packaging process. After plastic packaging, cleaning processes such as removing the tape and molding compound flash need to be performed, which increases the packaging cost.

Use a dicing knife to cut and separate traditional quad flat no-lead packages. The dicing knife will also cut the lead frame metal while cutting the plastic packaging material, which will not only reduce the cutting efficiency and shorten the life of the dicing blade, but also produce metal burrs. , affecting the reliability of the package

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