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Heat treatment technology for high-strength high-conduction low-Be Co-free Cu alloy

A technology of cobalt-copper alloy and beryllium-copper alloy, which is applied in the field of heat treatment process of high-strength, high-conductivity, low-beryllium, cobalt-free copper alloy, and can solve problems such as environmental pollution, restricted development and application, serious problems, etc.

Inactive Publication Date: 2012-02-01
CENT SOUTH UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, most of the currently used beryllium-copper alloys are limited to alloys with high beryllium content (Be31.8wt%), because of their high production cost, high price, and serious environmental pollution, which greatly limits their development and application.
The low-beryllium cobalt-free copper alloy has excellent electrical conductivity, but poor mechanical properties

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0009] The material used in the present invention is a low-beryllium cobalt-free copper alloy, namely Cu-Be-Ni. The measured composition weight percentage is: Be: 0.42%, Ni: 2.05%, and the rest is Cu and unavoidable trace impurities. The invention adopts vacuum melting and casting to obtain the alloy material, and the ingot size is 80×220×2000mm 3 , after the ingot is hot-rolled and rolled to 0.8mm several times, solution treatment is carried out at 920°C, and then water quenched to room temperature, and then the product is subjected to the deformation heat treatment of the present invention.

[0010] The alloy after solution quenching was pre-deformed by cold deformation to 38.5%, and the deformed alloy was heated to 465°C, kept for 2 hours, and then air-cooled to room temperature. Product performance: tensile strength 830MPa, yield strength 735MPa, relative conductivity 55.2%IACS.

Embodiment 2

[0012] The material used in the present invention is a low-beryllium cobalt-free copper alloy, namely Cu-Be-Ni. The actual measured composition weight percentage is: Be: 0.42%, Ni: 1.25%, and the rest is Cu and unavoidable trace impurities. The invention adopts vacuum melting and casting to obtain the alloy material, and the ingot size is 80×220×2000mm 3 , after the ingot is hot-rolled and rolled to 0.8mm several times, solution treatment is carried out at 925°C and then water-quenched to room temperature, and then the product is subjected to the deformation heat treatment of the present invention.

[0013] The alloy after solid solution quenching was pre-deformed with a cold deformation of 23.0%, and the deformed alloy was heated to 470 ° C, kept for 3 hours, and air-cooled to room temperature. Product performance: tensile strength 790MPa, yield strength 690MPa, relative conductivity 63.2%IACS.

Embodiment 3

[0015] The material used in the present invention is a low-beryllium cobalt-free copper alloy, namely Cu-Be-Ni. The measured composition weight percentage is: Be: 0.24%, Ni: 1.95%, and the rest is Cu and unavoidable trace impurities. The invention adopts vacuum melting and casting to obtain the alloy material, and the ingot size is 80×220×2000mm 3 , after hot-rolling the ingot and cold-rolling to 0.8mm several times, solution treatment is carried out at 910°C and then water quenched to room temperature, and then the product is subjected to the deformation heat treatment of the present invention.

[0016] The alloy after solution quenching was pre-deformed by cold deformation to 23.0%, and the deformed alloy was heated to 490 ° C, kept for 2 hours, and air-cooled to room temperature. Product performance: tensile strength 710MPa, yield strength 570MPa, relative conductivity 64.6%IACS.

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Abstract

The invention relates to a heat treatment technology for a high-strength high-conduction low-Be Co-free Cu alloy. The copper alloy comprises the following ingredients in percentage by weight: 0.15-0.5% of Be, 1-2.1% of Ni and the balance of Cu and inevitable trace impurities. The heat treatment technology comprises the following steps of: at 910-930DEG C, carrying out solution hardening; and then carrying out 8-40% of precooling deformation and aging treatment characterized by keeping warm for 2-3 hours at 440-490DEG C. After the low-Be Co-free Cu alloy adopts the heat treatment technology disclosed by the invention, the strength of the alloy is greatly improved, the tensile strength can be 710-830MPa, the yield strength can be 550-735MPa, and the relative conductivity is 45-65%IACS (International Annealed Copper Standard). According to the heat treatment technology system obtained by the invention, the mechanical property is greatly improved while the low-Be Co-free Cu alloy keeps high conductivity. A high-Be Cu alloy and a Co-contained low-Be Cu alloy with high price and serious pollution can be partially replaced.

Description

technical field [0001] The invention relates to a high-strength, high-conductivity, low-beryllium cobalt-free copper alloy heat treatment process, which belongs to the field of beryllium copper heat treatment. Background technique [0002] Low beryllium copper alloy is a high-quality elastic material with excellent comprehensive mechanical properties and electrical properties, and is widely used in mechanical electronics, aerospace and other industrial fields. In recent years, in order to meet the requirements of miniaturization and high density of electronic products, it is necessary to use beryllium copper alloy with high strength and high conductivity to make various high-performance components. However, most of the currently used beryllium copper alloys are limited to alloys with high beryllium content (Be31.8wt%), because of their high production cost, high price, and serious environmental pollution, which greatly limits their development and application. The low-beryl...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22F1/08C22C9/06
Inventor 刘楚明刘娜万迎春朱戴博陈志永
Owner CENT SOUTH UNIV
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