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Single-component photo-curable and thermal-curable adhesive and preparation method thereof

A double-curing, one-component technology, applied in the direction of modified epoxy resin adhesives, etc., can solve the problem that the shadow part cannot be completely cured, and achieve the effect of wide application range, uniform reaction system and excellent performance

Inactive Publication Date: 2013-06-19
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The beneficial effects of the present invention are: the adhesive of the single-component photothermal dual-curing agent of the present invention completely solves the problem that conventional light-curing adhesives cannot be completely cured in the shadow part, and the vinyl epoxy resin contains both acrylate and ring. The characteristics of oxygen groups can make the light curing reaction and thermal curing reaction well combined, so that the reaction system is uniform, the cured product has excellent performance, high bonding reliability, and a wide range of applications

Method used

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  • Single-component photo-curable and thermal-curable adhesive and preparation method thereof
  • Single-component photo-curable and thermal-curable adhesive and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0019] Weigh the raw materials accurately according to the following weight percentages, bisphenol A epoxy resin: 5%, vinyl epoxy resin: 5%, polyurethane acrylate oligomer: 45%, IBOA: 40%, photoinitiator: 184 : 3%, latent curing agent imidazole: 2%; add the above-mentioned components to the dual planetary power mixing mixer in sequence, evacuate to a vacuum of -0.08MPa, stir at 500 rpm for 2 hours, and stir evenly and naturally Leave it in the air to room temperature to obtain a single-component light-heat dual-curable adhesive, and then seal the package.

Embodiment 2

[0021] Weigh the raw materials accurately according to the following weight percentages, bisphenol F epoxy resin: 10%, vinyl epoxy resin: 10%, epoxy acrylate oligomer: 28%, THFAA: 35%, photoinitiator: TPO: 3%, latent curing agent dicyandiamide: 7%, latent curing agent dicyandiamide: 7%; add the above components to the dual planetary power mixer in turn, and vacuum until the vacuum is -0.05MPa , Stir at 750 rpm for 1 hour, stir evenly, and let it naturally dry to room temperature to obtain a single-component adhesive that can be double-cured by light and heat. The package can be sealed.

Embodiment 3

[0023] Accurately weigh the raw materials according to the following weight percentages: cycloaliphatic epoxy resin: 2%, vinyl epoxy resin: 2%, polyester acrylate: 50%, HDDA: 40%, photoinitiator 1173: 3%, Photoinitiator TPO: 2.5%, latent curing agent dicyandiamide: 0.5%; add the above-mentioned components to the double planetary power mixing mixer in turn, vacuum to -0.06MPa, and stir at 700 rpm for 1.5 After hours, stir evenly, and let it dry naturally to room temperature to obtain a single-component adhesive that can be double-cured by light and heat, and then seal the package.

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Abstract

The invention relates to a single-component photo-curable and thermal-curable adhesive and a preparation method thereof. The single-component photo-curable and thermal-curable adhesive consists of the following components in percentage by weight: 1 to 10 percent of epoxy resin, 1 to 10 percent of vinyl epoxy resin, 15 to 60 percent of acrylate oligomer, 20 to 50 percent of acrylate active diluent, 2 to 7 percent of photoinitiator and 0.5 to 7 percent of latent curing agent. The preparation method for the single-component photo-curable and thermal-curable adhesive comprises the following stepsof: weighing a proper amount of epoxy resin, vinyl epoxy resin, acrylate oligomer, acrylate active diluent, photoinitiator and latent curing agent in percentage by weight, adding into a stirrer in turn, uniformly stirring in vacuum, naturally cooling to room temperature, and performing sealing packaging.

Description

Technical field [0001] The invention relates to a curing agent, in particular to a single-component light-heat dual-curable adhesive and a preparation method thereof, which are suitable for bonding applications of shading or translucent materials and belong to the field of adhesives. Background technique [0002] Light-curing adhesives have been widely studied due to their fast curing speed, environmental friendliness, low energy consumption, no solvent volatilization and many other outstanding advantages, and they have been quickly promoted in various industries. However, light-curing adhesives also have their own limitations. Translucent materials or component shading parts absorb, block and reflect ultraviolet light. Photoinitiators often have low initiation efficiency and adhesives are not easy to cure completely, which greatly reduces the mechanical properties of the adhesive layer. . [0003] In order to solve the shortcoming that the shadow part cannot be cured in the photo...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/10
Inventor 潘光君王建斌陈田安解海华
Owner YANTAI DARBOND TECH
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