Sequentially etched and plated lead frame structure with island prepacked plastic sealed material and producing method thereof
A pre-filled molding compound and lead frame technology, which is applied in the direction of electrical components, electrical solid devices, circuits, etc., can solve the problems of unusable, complicated lead frame production procedures, and increased cost of lead frames, etc., to achieve process cost and quality cost reduction , reduce the risk of misalignment, and reduce the effect of complexity
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[0057] The invention relates to a method for producing a lead frame with a base island pre-filled plastic molding compound after plating and engraving as follows:
[0058] Step one, take the metal substrate
[0059] See figure 1 Take a piece of metal substrate 9 with a suitable thickness. The material of the metal substrate 9 can be changed according to the function and characteristics of the chip, such as: copper, aluminum, iron, copper alloy, stainless steel, or nickel-iron alloy.
[0060] Step two, filming operation
[0061] See figure 2 , Use filming equipment to paste photoresist films 10 and 11 that can be exposed and developed on the front and back of the metal substrate 9 after the metal layer is plated. The photoresist films 10 and 11 can be dry films or wet membrane.
[0062] Step 3: Remove part of the photoresist film from the front and back of the metal substrate
[0063] See image 3 , Using the exposure and development equipment to expose, develop and remove part of the ...
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