LED (light emitting diode) printed circuit board and production method thereof

Abstract

The invention discloses an LED (light emitting diode) printed circuit board and a production method thereof. The LED printed circuit board comprises a front copper foil, a back copper foil and a plurality through holes, wherein the front copper foil comprises a bonding pad, a wire and a heat-radiating copper foil which is insulated from the bonding pad and the wire; the through holes pass through a board body, and are communicated with the heat-radiating copper foil and the back copper foil; and the insides of the through holes are filled with rivet-shaped heat-conducting copper colloids, and the rivet-shaped heat-conducting copper colloids are connected with the heat-radiating copper foil and the back copper foil. According to the invention, the heat generated by an LED is conducted into the back heat-radiating copper foil by utilizing the outstanding heat-conducting performance of the copper colloid, thereby improving the heat-conducting efficacy of the LED printed circuit board, overcoming the defects that an aluminum-based material in the prior art only can achieve an effect of heat radiation but not heat conduction, and improving the heat radiation effect of the LED printed circuit board. The LED printed circuit board and production method thereof provided by the invention are suitable for the continuous production of molds, the stroke-frequency service life of a produced mold can be prolonged, the production efficiency is improved, and the formation machining cost of the LED printed circuit board is lowered.

Description

[technical field] [0001] The invention relates to a printed circuit board, in particular to an LED printed circuit board and a production method thereof. [Background technique] [0002] Existing LED printed circuit boards are mainly made of aluminum-based materials, and the aluminum substrate of the aluminum-based printed circuit board can only dissipate heat, not conduct heat, and the overall heat dissipation effect of the printed circuit board is relatively poor. Moreover, the material cost of the aluminum-based printed circuit board is relatively high, the forming process is relatively difficult, and the processing cost is also relatively high. The heat generated during CNC forming consumes the service life of the tool; during the stamping and forming of the mold, the mold produces static adsorption of aluminum chips, which affects the life of the mold, and the continuous production of stamping and forming of the mold is difficult, and continuous production will lead to p...

AI Technical Summary

Problems solved by technology

[0002] Existing LED printed circuit boards are mainly made of aluminum-based materials. The aluminum substrate of the aluminum-based printed circuit board can only dissipate heat, not conduct heat, and the overall heat dissipation effect of the printed circuit board is poor.

Moreover, the material cost of aluminum-based printed circuit boards is relatively high, the forming process is relatively difficult, and the processing cost is also relatively high.

The heat generated during CNC forming consumes the service life of the tool; when the mold is stamped and formed, the mold produces static adsorption of aluminum chips, which affects the life of the mold, and the stamping and forming of the mold is difficult to produce continuously, and continuous production will lead to poor product quality or product scrap

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