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A high-power LED drive power cooling device based on carbon nanotubes

An LED driver and carbon nanotube technology, applied in the power supply field, can solve the problems of insufficient thermal conductivity of materials, high cost, high density, etc., and achieve the effects of light weight, reduced lamp weight, and good heat transfer performance.

Inactive Publication Date: 2011-12-14
GUANGZHOU UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] Aiming at the problems of high density, high hardness, high cost and insufficient thermal conductivity of the material in the traditional metal material heat dissipation method, the present invention provides a high-power LED drive power heat dissipation device based on carbon nanotubes, which uses a new type of carbon Nanotubes (Carbon nanotubes, CNTs) materials are used as heat dissipation materials. Carbon nanotubes have the advantages of good thermal conductivity, light weight, easy portability and installation.

Method used

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  • A high-power LED drive power cooling device based on carbon nanotubes
  • A high-power LED drive power cooling device based on carbon nanotubes
  • A high-power LED drive power cooling device based on carbon nanotubes

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Embodiment 1

[0026] Specific embodiments of the present invention As shown in the accompanying drawings, a high-power LED drive power heat dissipation device based on carbon nanotubes, the heat sink 3 and the back of the PCB board 2 are connected by fasteners.

[0027] The heat sink 3 also includes a heat sink 303 at the bottom of the heat sink; the inside of the heat sink is coated with two layers of heat dissipation material, the layer close to the PCB board is thermally conductive adhesive, and the layer below the thermally conductive adhesive is carbon nanotubes .

[0028] The heat-conducting adhesive is closely combined with the PCB board 2 and the carbon nanotubes, which can better conduct heat from the PCB board to the carbon nanotubes.

[0029] When the power supply is working, a large number of electronic components are arranged on the PCB board 2 to generate a large amount of waste heat, which will be transferred from the PCB board 2 to the heat dissipation groove 303 at the bott...

Embodiment 2

[0031] Specific embodiments of the present invention As shown in the accompanying drawings, a high-power LED drive power cooling device based on carbon nanotubes includes a protective cover 1, a PCB board 2, and a radiator 3; the radiator 3 and the back of the PCB board 2 The connection is made through fasteners, and the protective cover 1 is connected with the radiator 3 through fasteners, and completely covers the PCB board 2 .

[0032] The heat sink 3 also includes a heat sink 303 at the bottom of the heat sink; the inside of the heat sink is coated with two layers of heat dissipation material, the layer close to the PCB board is thermally conductive adhesive, and the layer below the thermally conductive adhesive is carbon nanotubes .

[0033] The heat-conducting adhesive is closely combined with the PCB board 2 and the carbon nanotubes, which can better conduct heat from the PCB board to the carbon nanotubes.

[0034] When the power supply is working, a large number of el...

Embodiment 3

[0036] Specific embodiments of the present invention As shown in the accompanying drawings, a high-power LED drive power cooling device based on carbon nanotubes includes a protective cover 1, a PCB board 2, and a radiator 3; the radiator 3 and the back of the PCB board 2 The connection is made through fasteners, and the protective cover 1 is connected with the radiator 3 through fasteners, and completely covers the PCB board 2 .

[0037] There is also a wire outlet 102 on both sides of the protective cover 1 , such as a circuit on the PCB board, which can be introduced and exported from the outlet 102 .

[0038] The heat sink 3 also includes a heat sink 303 at the bottom of the heat sink; the inside of the heat sink is coated with two layers of heat dissipation material, the layer close to the PCB board is thermally conductive adhesive, and the layer below the thermally conductive adhesive is carbon nanotubes .

[0039] The heat-conducting adhesive is closely combined with t...

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Abstract

The invention discloses a high-power LED drive power cooling device based on carbon nanotubes, including a protective cover, a PCB board, and a radiator; Light weight, long life, simple structure design.

Description

technical field [0001] The invention relates to the technical field of power supplies, in particular to a high-power LED drive power cooling device based on carbon nanotubes. Background technique [0002] A power supply is a device that provides power to electronic equipment, also known as a power supply. It provides the electrical energy required by all components in the equipment. The size of the power supply, whether the current and voltage are stable will directly affect the working performance and service life of electronic equipment. [0003] LED power supply is a kind of power supply, which is widely used in: street lights, tunnel lights, LED grille lights, LED indoor lights, LED ceiling lights, buildings, roads and bridges, square building facilities, lawn lights, curtain wall lights, mobile phones, computers, etc. , Information plane display: display boards, dynamic billboards, simulated animation, stadiums, indicator lights and internal reading lights in the car,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
Inventor 郭康贤彭超舒浙伟
Owner GUANGZHOU UNIVERSITY
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