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Synthetic copper plate grinding disk

A technology of grinding discs and copper discs, which is applied in abrasives, metal processing equipment, manufacturing tools, etc., can solve the problems of increasing production costs, reducing production efficiency, and inconvenient installation of grinding discs, and achieves the effect of improving production efficiency and speeding up the smoothing process

Inactive Publication Date: 2011-11-16
上海百兰朵电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Since the grinding disc needs to be used in conjunction with the grinding liquid, the grinding disc needs to be cleaned regularly. During the process of grinding a large number of workpieces, the grinding rate will be reduced, and the existing grinding disc is inconvenient to install, and there is no special tool for installation. accessories, resulting in reduced production efficiency of the entire process of workpiece flattening, and increased production costs

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] 1. Preparation method:

[0020] Add the following components 100Kg in the reaction vessel:

[0021] Copper powder 90Kg;

[0022] Nickel powder 5Kg;

[0023] Cerium powder 5Kg,

[0024] After the above three substances are mixed, add the mixture of 10Kg of epoxy resin and polyurethane glue of the total amount of the above components.

[0025] The above-mentioned substances were heated to 100°C in a reaction vessel, stirred thoroughly, then molded, and cooled for 8 hours to form.

[0026] 2. Technical indicators: The hardness of the copper disc processed by this process is (hv800-1000). Install the disc on a special polishing machine, and carve threads on the disc surface (carve out threads with a depth of 150-200μm with a diamond knife V60R30) Cooperate with a special polishing solution (the particle size of the polishing solution is 5-7μm) to polish 2 inches of 5 pieces of sapphire. The surface roughness before polishing is about 0.05μm. 2ml / min, the polishing time...

Embodiment 2

[0028] 1. Preparation method:

[0029] Add the following components 100Kg in the reaction vessel:

[0030] Copper powder 95Kg;

[0031] Nickel powder 3Kg;

[0032] Cerium powder 2Kg,

[0033] After the above three substances are mixed, add the mixture of 30Kg of epoxy resin and polyurethane glue of the total amount of the above components.

[0034] The above-mentioned substances were heated to 200°C in a reaction vessel, stirred thoroughly, then molded, and cooled for 12 hours to form.

[0035] 2. Technical indicators:

[0036] The hardness of the copper disk processed by this process is (hv1000-1200). Install the disk on a special polishing machine, and carve threads on the surface of the disk (use a diamond knife V60R30 to carve threads with a depth of 150-200 μm) with a special polishing liquid (The particle size of the polishing liquid is 5-7 μm) Polish 2 inches of 5 pieces of sapphire. The surface roughness before polishing is about 0.05 μm. The time is 10 minutes, ...

Embodiment 3

[0038] 1. Preparation method:

[0039] Add the following components 100Kg in the reaction vessel:

[0040] Copper powder 90Kg;

[0041] Nickel powder 2Kg;

[0042] Cerium powder 8Kg,

[0043] After the above three substances are mixed, add the mixture of 50Kg of epoxy resin and polyurethane glue of the total amount of the above components.

[0044] The above-mentioned substances were heated to 150°C in a reaction vessel, stirred thoroughly, molded, and cooled for 10 hours to form.

[0045] 2. Technical indicators: the hardness of the copper disc processed by this process is (hv600-800). Install the disc on a special polishing machine, and carve threads on the disc surface (carve out threads with a depth of 150-200μm with a diamond knife V60R30) Cooperate with a special polishing solution (the particle size of the polishing solution is 5-7μm) to polish 2 inches of 5 pieces of sapphire. The surface roughness before polishing is about 0.05μm. 2ml / min, the polishing time is 1...

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PUM

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Abstract

The invention discloses a synthetic copper plate grinding disk which is characterized by comprising the following components: 90-95% of copper powder, 1-5% of nickel powder and 3-10% of cerium powder, and a mixture of epoxy resin and polyurethane adhesive, which accounts for 10-50% of the total amount of the above components and is added after mixing; and the preparation method of the synthetic copper plate grinding disk comprises the following steps: heating the mixture to 100-200 DEG C in a reaction container, thoroughly stirring, carrying out mould pressing, and cooling for 8-15 hours for forming. The synthetic copper plate grinding disk is used for grinding and polishing LED (light-emitting diode) chips, LED substrates, LED display screen optical crystals, silicon chips, compound crystals, liquid crystal panels, precious stones, ceramics, germanium wafers, metal workpieces and the like, and can significantly improve the grinding rate of the workpieces.

Description

technical field [0001] The invention relates to a grinding disc used for smoothing and grinding fine workpieces, in particular to a synthetic copper disc grinding disc. Background technique [0002] Special workpieces have requirements for the flatness of their surfaces, such as LED chips, LED substrates, LED display optical crystals, silicon chips, compound crystals, liquid crystal panels, gemstones, ceramics, germanium chips, metal workpieces, etc. Usually, the surface of these workpieces The leveling process requires a grinding disc, which is then polished with a grinding liquid. [0003] Since the grinding disc needs to be used in conjunction with the grinding liquid, the grinding disc needs to be cleaned regularly. During the process of grinding a large number of workpieces, the grinding rate will be reduced, and the existing grinding disc is inconvenient to install, and there is no special tool for installation. accessories, resulting in reduced production efficiency ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24D7/00
Inventor 朱孟奎
Owner 上海百兰朵电子科技有限公司
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