Avalanche photodiode for ultraviolet detection as well as manufacturing method and working procedure thereof
An avalanche photoelectric and diode technology, applied in circuits, electrical components, semiconductor devices, etc., to achieve the effects of improving stability, saving manufacturing costs, and being easy to implement
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[0042] The preparation method of the above-mentioned metal-semiconductor-metal MSM planar structure wide bandgap semiconductor ultraviolet avalanche photodiode comprises the following steps:
[0043] 1) Epitaxially grow the epitaxial layer of the epitaxially grown ultraviolet avalanche photodiode wafer on the homogeneous or heterogeneous substrate, the epitaxial layer structure includes buffer layer 102a, wide bandgap semiconductor light absorption layer 102b on the substrate from bottom to top, wide The bandgap semiconductor light-absorbing layer 102b can be a single-layer film or a multilayer film, and its basic feature is that the wide-bandgap semiconductor light-absorbing layer 102b has a bandgap width greater than 2.5eV, and a carrier concentration of less than 1×10 18 cm -3 The wide bandgap semiconductor material has a thickness between 50nm and 1mm. Typical wide bandgap semiconductors include GaN, AlN, ZnO, SiC, diamond, and ternary or quaternary alloy materials thereo...
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