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Substrate for flexible luminescent device and preparation method thereof

A technology for light-emitting devices and substrates, which is used in the manufacture of semiconductor/solid-state devices, electric solid-state devices, semiconductor devices, etc., and can solve the problems of poor surface flatness of thin-layer carbon nanotubes, poor bonding force between carbon nanotubes and flexible substrates, etc.

Inactive Publication Date: 2011-10-05
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0008] The technical problem to be solved by the present invention is how to provide a substrate for flexible light-emitting devices and its preparation method. The substrate solves the problems of poor surface flatness of thin-layer carbon nanotubes and poor bonding force between carbon nanotubes and flexible substrates. , improve the conductivity of the conductive layer and the barrier ability of the substrate to water and oxygen

Method used

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  • Substrate for flexible luminescent device and preparation method thereof
  • Substrate for flexible luminescent device and preparation method thereof
  • Substrate for flexible luminescent device and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0099] Such as figure 1 In the substrate structure shown, the flexible substrate 1 uses an adhesive that requires double curing, and the conductive layer 2 uses carbon nanotubes, the gaps of the carbon nanotube layer are filled with organic light-emitting materials, and the thickness of the carbon nanotube layer is 70nm.

[0100] The preparation method is as follows:

[0101] ① Clean the glass substrate with surface roughness less than 1nm, and dry it with dry nitrogen after cleaning;

[0102] ② Evenly disperse carbon nanotubes in a solvent, and prepare a carbon nanotube layer on a clean substrate by spin coating. The rotation speed of spin coating is 4000 rpm, the duration is 60 seconds, and the film thickness is about 70 nanometers;

[0103] ③ Drop-coat the solution containing organic light-emitting materials on the carbon nanotube layer, place the glass substrate in an environment of 80°C for 30 minutes, remove the remaining solvent in the carbon nanotube layer, and then s...

Embodiment 2

[0111] Such as figure 1 As shown in the substrate structure, the flexible substrate 1 adopts an adhesive that requires double curing, the conductive layer 2 adopts carbon nanotubes, the gaps of the carbon nanotube layer are filled with organic light-emitting materials, and the thickness of the carbon nanotube layer is 60 nm. The adhesive raw materials include the following components:

[0112]

[0113] The preparation method is similar to Example 1.

Embodiment 3

[0115] Such as figure 1 As shown in the substrate structure, the flexible substrate 1 adopts an adhesive that requires double curing, the conductive layer 2 adopts carbon nanotubes, and the gaps of the carbon nanotube layer are filled with organic light-emitting materials, and the thickness of the carbon nanotube layer is 50 nm. The adhesive raw materials include the following components:

[0116]

[0117] The preparation method is similar to Example 1.

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Abstract

The invention discloses a substrate for a flexible luminescent device. The substrate comprises a flexible substrate and a conducting layer, wherein the flexible substrate and the conducting layer are formed by one of the following two ways: (1) the flexible substrate is an adhesive needing dual-curing; the conducting layer is a thin layer carbon nanotube; and the gap of the thin layer carbon nanotube is filled with organic luminescent materials; and (2) the flexible substrate is an organic luminescent material doped adhesive needing dual-curing; the conducting layer is a thin layer carbon nanotube; the gap of the thin layer carbon nanotube is filled with the organic luminescent material doped adhesive needing dual-curing; and the adhesive needing dual-curing comprises an ultraviolet curing-thermocuring system, an ultraviolet curing-microwave curing system, an ultraviolet curing-anaerobic curing system and an ultraviolet curing-electron beam curing system.

Description

technical field [0001] The invention relates to the technical field of organic optoelectronics, in particular to a substrate for a flexible light-emitting device and a preparation method thereof. Background technique [0002] Optoelectronics technology is a rapidly developing industry with high technological content after microelectronics technology. With the rapid development of optoelectronic technology, optoelectronic products such as solar cells, optical image sensors, flat panel displays, and thin film transistors have gradually matured, and they have greatly improved people's lives. At the same time, the wide application of optoelectronic information technology in various fields of social life has also created a huge growing market. Developed countries regard the optoelectronic information industry as one of the key development areas, and the competition in the optoelectronic information field is unfolding worldwide. [0003] Optoelectronics technology is a rapidly d...

Claims

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Application Information

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IPC IPC(8): H01L51/52H01L51/54C09J4/02C09J167/06C09J4/00C09J163/00H01L51/56
Inventor 蒋亚东于军胜李璐王娜娜
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
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