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Method for improving safety insulation voltage endurance of light-emitting diode (LED) integrating face light source

A technology of insulation withstand voltage and surface light source, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., and can solve the problems that cannot reliably meet the requirements of insulation withstand voltage

Inactive Publication Date: 2011-09-14
北工(常熟)工业技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a method for improving the safety insulation and withstand voltage of LED integrated surface light sources, which solves the problem that the existing technology cannot reliably meet the insulation and withstand voltage requirements of safety regulations above 2500V

Method used

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  • Method for improving safety insulation voltage endurance of light-emitting diode (LED) integrating face light source
  • Method for improving safety insulation voltage endurance of light-emitting diode (LED) integrating face light source
  • Method for improving safety insulation voltage endurance of light-emitting diode (LED) integrating face light source

Examples

Experimental program
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Effect test

Embodiment 1

[0030] refer to figure 2 , is a double-sided aluminum oxide ceramic copper-clad laminate 5 bracket for carrying 50 LEDs. According to the power of a single LED chip, it can form a 25W-50W integrated surface light source, with a total size of 31mm×16mm. The bottom layer is all copper, the middle insulation layer 2 is made of aluminum oxide ceramic layer with a thickness of 0.38mm, and the upper layer is made of 50 LED copper foil islands 4. A 0.075-0.1um silver layer can be plated to facilitate the bonding of a single LED chip with conductive silver paste. The width of the partition wall where the copper layer is corroded is 1mm, and the edge of the whole board is left with a 1mm isolation strip for corroding the copper layer.

Embodiment 2

[0032] refer to image 3 , to carry 100 LED double-sided aluminum nitride ceramic copper-clad laminate 5 brackets, considering high-power heat dissipation, aluminum nitride ceramic copper-clad laminate 5 is used for the bracket, according to the power of a single LED chip, it can form a 100W-200W integrated surface light source , The total size is 31mm×31mm. The bottom layer is all copper, and the middle insulating layer 2 is made of 0.25mm thick aluminum nitride ceramic insulating layer. The thermal conductivity of aluminum nitride is as high as 170-220W / mK, which can further reduce thermal resistance and meet high-power heat dissipation requirements. Make 100 LED bonding copper foil islands 4 on the upper layer. The single island size is 2mm×2mm, and the copper foil island 4 with a thickness of 0.3mm can be plated with 0.075-0.1um silver layer to facilitate the bonding of a single LED chip with conductive silver paste. Then, the width of the partition wall where the copper ...

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Abstract

The invention discloses a method for improving the safety insulation voltage endurance of a light-emitting diode (LED) integrating face light source. A ceramic copper-clad plate serves as a bracket; the lower layer of the ceramic copper-clad plate is a copper matrix layer; an insulating layer in the middle of the ceramic copper-clad plate is made of a ceramic material; the upper layer of the ceramic copper-clad plate is a copper conducting layer; and copper foil islands with a loading effect can be corroded from the copper conducting layer. The method comprises the following steps of: 1, determining the total number Q of light-emitting diodes (LED) on the bracket, namely determining the total number Q of the copper foil islands on the bracket; 2, determining the size of a single copper foil island on the upper layer of the bracket; 3, determining the numbers of cross rows M and vertical rows N of a matrix of the copper foil islands on the bracket, wherein M*N is equal to Q; and 4, determining the total size of length and width of the bracket according to the size of the single copper foil, the number Q of the island matrix, distances between the copper foil islands and the whole edge distance. The insulation voltage endurance requirement of which the safety is more than 2,500V can be met and the original radiating effect is not affected at the same time.

Description

technical field [0001] The invention belongs to the technical field of LED semiconductor solid-state lighting, and relates to a method for improving the safety insulation and withstand voltage of an LED integrated surface light source. Background technique [0002] LEDs are more and more widely used as lighting sources, but LED lamps are more or less difficult to pass the safety insulation withstand voltage test, especially the integrated surface light source. Due to the consideration of good heat dissipation requirements, LED lamps are generally used The chip is directly bonded to a thermoelectric good conductor (such as a copper plate) with a conductive silver paste. In this way, only the LED chip substrate is used for mechanical insulation. Even the lowest insulation withstand voltage of 500V is difficult to pass. According to the different operating voltages of LED light sources, insulation withstand voltage requirements ranging from 500V to 2000V are required. Consideri...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/00H01L33/48H01L33/64
Inventor 刘义芳邢先锋王清平李志强
Owner 北工(常熟)工业技术有限公司
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