High-ductility electrolytic copper foil surface reddening method

A technology of electrolytic copper foil and treatment method, applied in the field of electrolysis, can solve the problems of poor adhesion and insufficient oxidation resistance of copper foil, and achieve the effects of improving peel strength, increasing chemical affinity, and blocking attacks

Inactive Publication Date: 2011-08-31
梅州市梅县区金象铜箔有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the conventional treatment of domestic high-stretch electrolytic copper foil is to adopt conventional treatment, which is generally an acidic process and a single roughening solution process, that is, the ashing electrolyte is acidic or weakly alkaline, and the copper foil produced is not high enough in oxidation resistance. Such high ductility electrolytic copper foil brings many problems to the production of multilayer circuit boards.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] Take a piece of copper foil, first the copper foil is cleaned by a surface treatment machine at a speed of 15m / min, the oxide on the surface of the copper foil is removed, and the surface is etched, and then the treated copper foil is placed in a copper content of 10 / L, Acid content of 100g / L, hydroxyethyl cellulose 0.5 / kWh roughened electrolyte, 7500A current was passed through at 40°C for electroplating; then the roughened copper foil was placed in copper content of 40g / L, acid In the solidified electrolyte with a content of 100g / L, a current of 6000A is applied at 40°C for electroplating, so that the roughened tumor is surrounded and reinforced by the normal copper plating layer, and the roughened layer is firmly combined with the copper foil substrate to form the final roughened layer Then, in the ashing electrolyte with a chromium content of 1.0 g / L, add sodium hydroxide to adjust the pH of the ashing electrolyte to 11.50, and feed 40A at 30°C for electroplating; th...

Embodiment 2

[0019] Example 2 Take a piece of copper foil. First, the copper foil is cleaned by a surface treatment machine at a speed of 15m / min to remove oxides on the surface of the copper foil, and the surface is etched, and then the treated copper foil is put into / L, acid content 120g / L, hydroxyethyl cellulose 0.6 / kWh roughening electrolyte, 7500A electric current is passed through at 30°C for electroplating; then roughened copper foil is put into copper content 60g / L. In the solidified electrolyte with an acid content of 120g / L, a current of 5600A is applied at 45°C for electroplating, so that the roughened tumor is surrounded and reinforced by the normal copper plating layer, and the roughened layer is firmly combined with the copper foil substrate to form the final Coarse layer; then put the copper foil in the ashing electrolyte with a chromium content of 4.0 g / L, add sodium hydroxide to adjust the pH of the ashing electrolyte to 13.50, and pour 30A at 40°C for electroplating; the...

Embodiment 3

[0021] Take a piece of copper foil. First, the copper foil is cleaned by a surface treatment machine at a speed of 15m / min to remove oxides on the surface of the copper foil and etch the surface. Then put the treated copper foil into a Acid content of 140g / L, hydroxyethyl cellulose 0.8 / kWh roughened electrolyte, 11000A electric current was passed through at 50°C for electroplating; then roughened copper foil was placed in copper content 70g / L, acid In the solidified electrolyte with a content of 150g / L, a current of 9000A is applied at 50°C for electroplating, so that the roughened tumor is surrounded and reinforced by the normal copper plating layer, and the roughened layer is firmly combined with the copper foil substrate to form the final roughened layer Then, add sodium hydroxide to the ashing electrolyte with a chromium content of 8 g / L to adjust the pH of the ashing electrolyte to 15.00, and feed 45A at 40°C for electroplating; then the copper foil with a zinc content of ...

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Abstract

The invention discloses a high-ductility electrolytic copper foil surface reddening method which has the following technical points: cellulose ether is added into a coarsening electrolyte for coarsened layer treatment, and the pH values of a graying electrolyte for graying treatment and a passivating electrolyte for passivating treatment are respectively 10-15. The copper foil coarsened surface produced by the invention has fine and uniform crystal grains, thereby reducing the skin effect of the copper foil when the circuit board is made into a circuit, preventing rear side corrosion caused by excessive dissimilar metal coatings in the preparation process of the copper clad plate, maintaining the characteristic of high ductility of the high-ductility electrolytic copper foil, and being beneficial to enhancing the chemical affinity between the copper foil and substrate and improving the peel strength and oxidation resistance. The invention belongs to the technical field of electrolytic copper foils.

Description

technical field [0001] The invention discloses a method for treating the surface of copper foil, in particular relates to a method for reddening the surface of high ductility electrolytic copper foil, which belongs to the technical field of electrolysis. Background technique [0002] Electrolytic copper foil is electrodeposited on the cathode roller by copper sulfate electrolyte under the action of current, and constitutes "three important materials" with resin and reinforcing material. Conventional standard foil is an important material for the manufacture of copper clad laminates (CCL) and printed circuit boards (PCB). The production of multi-layer boards requires temperature-resistant characteristics, and high-stretch electrolytic copper foils are produced from this. [0003] At present, the conventional treatment of high-stretch electrolytic copper foil in China is to adopt conventional treatment, which is generally acidic process treatment and single roughening solutio...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D5/10C25D3/38C25D11/34C25D7/06
Inventor 王崇华刘焕添李建伟李俊涛陈优昌叶敬敏张小玲郭丽平付文锋吴红兵黄国和
Owner 梅州市梅县区金象铜箔有限公司
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