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Bismaleimide resin system and preparation method thereof

A technology of maleimide resin and bismaleimide is applied in the field of bismaleimide resin system and its preparation, and the field of bismaleimide resin composite material, which can solve the problem that the cured product is brittle, The thermal expansion coefficient does not match the electronic device, and the dielectric constant and dielectric loss are high

Inactive Publication Date: 2011-08-24
SUZHOU UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the high dielectric constant (ε=3.7~4.1) and high dielectric loss (tanδ=0.007~0.009) of the existing high-performance thermosetting bismaleimide (BMI) resin, the thermal expansion coefficient does not match the electronic device, and the cured product Disadvantages such as high brittleness can no longer meet the above material performance requirements, so it is necessary to find a new type of bismaleimide resin system

Method used

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  • Bismaleimide resin system and preparation method thereof
  • Bismaleimide resin system and preparation method thereof
  • Bismaleimide resin system and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] Weigh 100g of 4,4′-bismaleimidodiphenylmethane and 100g of diallyl bisphenol A, put them into a 250ml beaker, raise the temperature to 120~140°C, and wait for the resin to melt and become transparent, respectively under stirring conditions. Add 5, 8, and 10 g of polyphenylene ether-coated epoxy resin (E-51) microcapsules with an average particle size of 220 μm. (CN 101560322) The technical solution was obtained.

[0023] React at a temperature of 120-140°C for 30 minutes, inject the resin system into a mold coated with a release agent after defoaming, and vacuumize at 80-90°C for about 20 minutes, according to 120°C / 1h+150°C / 2h+180°C / 2h+200 ℃ / 2h process curing.

[0024] Cut the prepared material into required size samples on the cutting machine, measure its dielectric properties and glass transition temperature, relevant data such as figure 1 , figure 2 And shown in Table 1.

[0025] See attached figure 1 And attached figure 2 , it is according to the preparatio...

Embodiment 2

[0031] Weigh 100g of 4,4′-bismaleimidodiphenylmethane and 75g of diallyl bisphenol A, put them into a 250ml beaker, raise the temperature to 120~140°C, and wait until the resin is melted and transparent, under stirring conditions Add 2, 5, 8, and 10 g of polyphenylene ether-coated epoxy resin (E-51) microcapsules with an average particle size of 120 μm, and continue to react at this temperature for 30 minutes. After defoaming, the resin system is injected with a release agent In the mold, vacuumize at 80~90°C for about 20 minutes, and cure according to the process of 120°C / 1h+150°C / 2h+180°C / 2h+200°C / 2h. Cut the prepared material into required size samples on the cutting machine, measure its dielectric properties and glass transition temperature, relevant data such as image 3 , Figure 4 And shown in Table 2.

[0032] See attached image 3 And attached Figure 4 , which is according to the technical scheme of this embodiment, the dielectric properties of the cured bismalei...

Embodiment 3

[0037] Weigh 100g of 4,4′-bismaleimidodiphenylmethane and 100g of diallyl bisphenol A, put them into a 250ml beaker, raise the temperature to 120~140°C, and wait until the resin is melted and transparent, under stirring conditions Add 0.5, 2, and 5 g of polyphenylene ether-coated epoxy resin (E-51) microcapsules with an average particle size of 50 μm, and continue to react at this temperature for 30 minutes. After defoaming, the resin system is injected into a mold coated with a release agent In the process, vacuumize at 80~90°C for about 20 minutes, and cure according to the process of 120°C / 1h+150°C / 2h+180°C / 2h+200°C / 2h. Cut the prepared material into required size samples on the cutting machine, measure its dielectric properties and glass transition temperature, relevant data such as Figure 5 , Figure 6 And shown in Table 3.

[0038] See attached Figure 5 And attached Figure 6 , which is according to the technical scheme of this embodiment, the dielectric properties...

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Abstract

The invention discloses a bismaleimide resin system and a preparation method thereof. In the method, a polyphenyl ether coated epoxy resin microcapsule is filled into allyl compound modified BMI (Bismaleimide) to obtain a novel BMI resin system. Compared with the BMI resin system in which the microcapsule is not added, the novel resin system has low dielectric constant, and glass-transition temperature is improved. The novel resin system can be used for the frontier field of national defense and civil industry, such as the production of aerospace materials, electron components and the like.

Description

technical field [0001] The invention relates to a bismaleimide resin composite material, in particular to a bismaleimide resin system with low dielectric constant and high heat resistance and a preparation method thereof, belonging to the technical field of high-performance composite materials . Background technique [0002] The 21st century has entered a highly information-based society, and electronic products are rapidly developing towards miniaturization, high performance and high reliability. It is required that CCL must have properties such as low dielectric constant and dielectric loss, low moisture absorption, high temperature resistance, high dimensional stability, and high toughness. Due to the high dielectric constant (ε=3.7~4.1) and high dielectric loss (tanδ=0.007~0.009) of the existing high-performance thermosetting bismaleimide (BMI) resin, the thermal expansion coefficient does not match the electronic device, and the cured product Disadvantages such as hig...

Claims

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Application Information

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IPC IPC(8): C08L79/08C08L71/12C08L63/00C08L63/02C08G73/12
Inventor 袁莉梁国正顾嫒娟陈凤林超
Owner SUZHOU UNIV
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