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Electrostatic chuck (esc) comprising a double buffer layer (dbl) to reduce thermal stress

A technology of electrostatic chuck and buffer layer, which is applied in the direction of holding devices, circuits, and electrical components that apply electrostatic attraction, can solve problems such as fractures, and achieve the effect of increasing durability and reducing cracks.

Active Publication Date: 2011-08-10
KOMICO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As the electrostatic chuck 100 is repeatedly operated, the crack will spread to the upper portion of the substrate 102 until the entire substrate 102, and eventually, the substrate 102 will be broken due to the crack.

Method used

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  • Electrostatic chuck (esc) comprising a double buffer layer (dbl) to reduce thermal stress
  • Electrostatic chuck (esc) comprising a double buffer layer (dbl) to reduce thermal stress
  • Electrostatic chuck (esc) comprising a double buffer layer (dbl) to reduce thermal stress

Examples

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Embodiment Construction

[0022] Various example embodiments will be described more fully hereinafter with reference to the accompanying drawings in which some example embodiments are shown. This invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these example embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. In the drawings, the size and relative sizes of layers and regions may be exaggerated for clarity.

[0023] It will be understood that when an element or layer is referred to as being "on," "coupled" or "connected to" another element or layer, it can be directly on, connected to, or directly on the other element or layer. Either the layers are directly connected or coupled, or there are intervening elements or layers. In contrast, when an element is referred to as being "directly on," "directly coupled to" o...

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Abstract

Disclosed is an electrostatic chuck comprising a buffer layer to absorb thermal stress. The electrostatic chuck comprises: a main body having transverse holes; a base plate disposed on the upper side of said main body and including insertion holes corresponding to said transverse holes, and an electrode layer partially exposed through said insertion holes, to secure an object to be held by the electrostatic energy of said electrode layer; a terminal unit having a contact terminal connected to said electrode layer through said transverse holes and said insertion holes; and a buffer layer disposed at at least one boundary between said contact terminal, said main body, and said base plate so as to be able to absorb thermal stress from said main body.; According to the present invention, the buffer layer of the electrostatic chuck absorbs thermal stress, thereby minimising cracks due to thermal stress and extending the life of the chuck.

Description

technical field [0001] Exemplary embodiments relate to an electrostatic chuck within a processing chamber, and more particularly, to an electrostatic chuck covered with a buffer layer for reducing thermal stress during processing using the electrostatic chuck and enabling the Thermal stress results in minimal cracking of the electrostatic chuck. Background technique [0002] In general, processes for manufacturing semiconductor devices and flat panel devices such as liquid crystal display (LCD) devices include deposition processes such as chemical vapor deposition (CVD) and etching processes such as reactive ion etching processes. In the above-mentioned deposition process and etching process, substrates such as silicon wafers and glass panels need to be fastened to electrode sheets in the processing chamber to improve process reliability. The substrate is typically secured to electrode pads within the processing chamber by an electrostatic chuck (ESC). [0003] figure 1 i...

Claims

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Application Information

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IPC IPC(8): H01L21/02
CPCH01L21/6833H02N13/00H01L21/324H01L21/67098
Inventor 崔镇植崔正德
Owner KOMICO
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