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PCB board with heat radiation structure and processing method thereof

A technology of PCB board and heat dissipation structure, which is applied to circuit thermal devices, cooling/ventilation/heating transformation, porous dielectrics, etc. Low, lower thermal resistance effect

Inactive Publication Date: 2011-08-03
TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the existing solutions increase the process, not only the heat dissipation effect is not good, the installation is complicated, but also the cost is increased, and it is not easy to carry and repair

Method used

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  • PCB board with heat radiation structure and processing method thereof
  • PCB board with heat radiation structure and processing method thereof
  • PCB board with heat radiation structure and processing method thereof

Examples

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Comparison scheme
Effect test

Embodiment Construction

[0027] The general idea of ​​the technical solution of the present invention is: the carrier layer of the PCB board is made into a porous heat-conducting layer with insulation and heat conduction or electrical conduction and heat conduction, and the holes of the porous heat-conducting layer are filled with heat-conducting liquids such as heat-conducting inks or solid-liquid phase change heat-conducting materials, In order to reduce the thermal resistance between the contact interface of the LED and the PCB board, and improve the heat conduction effect of the PCB board.

[0028] The technical solution for realizing the purpose of the invention will be described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0029] Please refer to figure 1 The PCB board with heat dissipation structure proposed ...

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Abstract

The invention discloses a PCB board with a heat radiation structure, which comprises a conductive layer and a printed circuit board (PCB) carrier layer. The PCB carrier layer is a porous heat conduction layer, and heat conduction liquids or solid-liquid phase-changeable heat conduction materials are injected into holes of the porous heat conduction layer. The conductive layer is arranged on a first face of the porous heat conduction layer, and the second face of the porous heat conduction layer is a contact interface with outside mediums. The carrier layer of the PCB board is the porous heat conduction layer made of porous materials with good heat conduction, and heat conduction liquids or solid-phase phase-changeable heat conduction materials permeate into the holes of the porous heat conduction layer. When the PCB board is heated, expansion coefficients of the porous materials and the heat conduction ink are different; the inks are separated from the porous materials and the separated heat conduction inks fill an air gap between the contact interface and the porous material in the contact interface of the PCB board through a phenomenon so as to greatly reduce heat resistance between the light emitting diode (LED) and contact interface and enhance heat conduction of the PCB board. Moreover, the cost is low, structure is simple and assembly is convenient.

Description

technical field [0001] The invention relates to the technical field of PCB (Printed Circuit Board, printed circuit board), in particular to a PCB board with a heat dissipation structure and a processing method thereof. Background technique [0002] In existing LED (Light Emitting Diode, light emitting diode) product applications, it is usually necessary to assemble multiple LEDs on one PCB. In addition to the role of the PCB board to carry the structure of the LED module, on the other hand, as the output power of the LED becomes higher and higher, the PCB board must also play the role of heat dissipation to transfer the heat generated by the LED. [0003] Traditional PCB boards for LEDs include a carrier board (ie, a carrier layer) and a conductive layer, and a heat-conducting insulating layer is usually provided between the conductive layer and the carrier board; the carrier board is usually a heat-conducting metal that has the function of heat conduction and heat dissipati...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K7/20H05K3/00H01L33/64
CPCC04B2237/40C04B2237/062C04B35/64C04B37/025H05K2201/10106H05K2201/0116C04B2237/365H05K1/0306C04B2237/34C04B2237/36H05K1/0203C04B2237/343
Inventor 张田
Owner TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
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