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Metal and conductive plastic composite micro heat exchanger

A technology of heat-conducting plastics and micro-heat exchangers, which is applied in the direction of indirect heat exchangers, heat exchanger types, semiconductor devices, etc., can solve the problems of large heat exchangers, large consumption of fin metal materials, and poor compactness. Achieve high thermal conductivity, fast heat transfer and good processability

Active Publication Date: 2011-06-29
BEIJING UNIV OF CHEM TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the application, this kind of heat exchanger has some shortcomings, such as large consumption of fin metal materials, and limited by material processing technology, fins usually have a simple structure, poor compactness, and the overall volume of the heat exchanger is large

Method used

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  • Metal and conductive plastic composite micro heat exchanger
  • Metal and conductive plastic composite micro heat exchanger
  • Metal and conductive plastic composite micro heat exchanger

Examples

Experimental program
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Effect test

Embodiment 1

[0022] refer to figure 1 , a finned heat sink with a plastic microstructure that can be used as a heat sink for heat-generating electronic devices. This embodiment is composed of a metal substrate 1 and a composite high thermal conductivity plastic microstructure 2, and the microstructure 2 is a miniature thermal conductivity plastic fin compounded on the metal surface. figure 1 The metal substrate is made of thick 1×60×60mm aluminum sheet, and the fins are made of 0.2×8×60mm CoolPoly heat-conducting plastic, with the spacing between fins being 0.4mm. figure 2 It is a partially enlarged view. Experiments show that under the same heating power, the heat exchange effect of the present invention is close to that of conventional aluminum fins. This embodiment is applied to the case where the surrounding of the heat exchanging fins is gas.

Embodiment 2

[0024] refer to image 3 , a flat plate heat exchanger with plastic microchannels. In this embodiment, composite thin plates with wide and flat microchannels are connected and stacked together by diffusion bonding, and cold and hot fluids alternately flow through these thin plates, and heat exchange is realized through both sides of the thin plate walls. Refer to the internal structure of the heat exchanger image 3 , the flat plate is a 2×40×60mm composite board, including a copper substrate 4 and a CoolPoly heat-conducting plastic rectangular fin 5 compounded on the copper substrate (see the specific structure diagram of the flat plate Figure 4 ), the size of the fins is 0.2×1.2×60mm, which are arranged on the plate in sequence to form a fluid microchannel with a width of 0.5mm. The fins are processed on the plate surface by micro-injection to form a channel space for dividing the main fluid. The multi-layer composite plates are stacked together to form a cubic multi-laye...

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Abstract

The invention discloses a metal and conductive plastic composite micro heat exchanger, belonging to the technical field of heat exchangers. In the heat micro-exchanger, a shell with heat insulating function is sleeved outside the heat exchanger to protect internal panels; a seal head for distributing or collecting fluid is welded on the shell, and mouths of cold and heat fluid inlet and outlet pipes are welded on the seal head; and particular structures can be arranged according to requirements. The heat micro-exchanger is characterized in that the internal panels comprise a metal substrate and a plastic micro-structure, wherein metal is used as a conductive substrate, and the conductive plastic of a micro-structure is compounded on the metal substrate. By the metal and conductive plastic composite heat micro-exchanger, the processing cost is greatly reduced, and the micro-channel made of plastic is difficult to scale compared with that made of metal materials.

Description

technical field [0001] The invention relates to a novel micro-heat exchanger composited with metal and heat-conducting plastic, belonging to the technical field of heat exchangers. Background technique [0002] With the development of science and technology, the field of people's research has expanded from the macrocosm to the microcosm. Driven by the semiconductor industry and the MEMS industry, people have developed large-scale and ultra-large-scale integrated circuits to meet technical requirements. As the integration of electronic devices becomes higher and higher, the power consumption and calorific value are also continuously increased, while the physical size is getting smaller and smaller, and the heat flux density of electronic devices is greatly increased. Relevant studies have shown that high temperature environments will degrade the reliability and performance of electronic components, requiring more efficient thermal control. At present, the heat flux density ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F28F3/02F28D9/00F28F3/08F28F21/00H01L23/367H01L23/373
Inventor 吴大鸣庄俭张亚军孙哲然
Owner BEIJING UNIV OF CHEM TECH
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