Semiconductor chip set
A semiconductor and chip set technology, applied in the field of semiconductor chip sets and their manufacturing, and high-power semiconductor components, can solve the problems of limited routing capability, excessive volume, and limited heat dissipation effect.
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[0110] The invention is a semiconductor chip assembly body, which at least includes a semiconductor component, a heat dissipation seat, a substrate and an adhesive layer. The semiconductor component is electrically connected to the substrate and thermally connected to the heat dissipation seat, and the heat dissipation seat at least includes a protrusion and a base. wherein the protrusion extends upward through an opening of the adhesive layer and enters a through hole of the substrate, the base extends laterally from the protrusion, and the adhesive layer extends between the protrusion and the substrate and between the base and the substrate. The substrate at least includes first and second conductive layers and a dielectric layer therebetween. Thereby, the substrate can provide a pad and a terminal on the first conductive layer by using a routing line on the second conductive layer and the first and second conductive holes passing through the dielectric layer between the co...
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