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Geothermal floor and junction structure thereof

A geothermal floor and substrate technology, applied in the field of building decoration materials, can solve the problems of difficult heat transfer quickly, low heat conduction efficiency, long heat conduction path, etc., and achieve the effect of short heat conduction path, high heat conduction efficiency, and not easy to crack

Inactive Publication Date: 2011-05-18
李渊
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a geothermal floor and a combination structure with short heat conduction path, high heat conduction efficiency, and heat can be quickly transferred to the surface, which solves the problem of long heat conduction path, low heat conduction efficiency, and heat loss in the prior art. It is difficult to quickly transfer to the floor surface, and the manufacturing process is complicated, etc.

Method used

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  • Geothermal floor and junction structure thereof
  • Geothermal floor and junction structure thereof
  • Geothermal floor and junction structure thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Embodiment 1: as figure 1 and figure 2 As shown, a geothermal floor includes a decorative surface plate 1 and a base plate 3 and a heat conduction medium 2 arranged between the decorative surface plate and the base plate, such as image 3 As shown, the heat conduction medium 2 is flat and long as a whole, the heat conduction medium 2 is an aluminum alloy profile and the upper and lower surfaces of the heat conduction medium have a plurality of second through holes 25 passing through the upper and lower surfaces; the heat conduction medium 2 includes a heat conduction medium upper surface 21, a heat conduction medium The lower surface of the medium 22, the left side 26 of the heat-conducting medium, and the right side 27 of the heat-conducting medium, wherein the left side 26 of the heat-conducting medium and the right side 27 of the heat-conducting medium each form an arc-shaped fold bent in the direction of the lower surface 22 of the heat-conducting medium , the cur...

Embodiment 2

[0025] Embodiment 2: as Figure 4 and Figure 5 As shown, a geothermal floor combination structure includes a first geothermal floor 5 and a second geothermal floor 6, the right side of the first geothermal floor 5 and the left side of the second geothermal floor 6 are connected to each other through a lock, wherein, The fourth contact surface 241 on the heat transfer medium 2 on the right side of the first geothermal floor 5 is surrounded by the second contact surface 231 on the heat transfer medium 2 on the left side of the second geothermal floor 6 to form a relatively closed section. The second cavity 7; as Figure 5 As shown, the second cavity 7 is provided with a strip-shaped heat source carrier 10, and the heat source carrier 10 of the present invention is a soft water pipe 8 for hot water to pass through; the outer surface of the soft water pipe 8 and the second contact surface 231 and the fourth contact surface The close contact of the surfaces 241 is conducive to t...

Embodiment 3

[0026] Embodiment 3: as Figure 4 and Figure 6 As shown, a geothermal floor combination structure includes a first geothermal floor 5 and a second geothermal floor 6, the right side of the first geothermal floor 5 and the left side of the second geothermal floor 6 are connected to each other through a lock, wherein, The fourth contact surface 241 on the heat transfer medium 2 on the right side of the first geothermal floor 5 is surrounded by the second contact surface 231 on the heat transfer medium 2 on the left side of the second geothermal floor 6 to form a relatively closed section. The second cavity 7; as Figure 6As shown, the second cavity 7 is provided with a strip-shaped heat source carrier 10, and the heat source carrier 10 of the present invention is a heating cable 9; the outer surface of the heating cable 9 is in close contact with the second contact surface 231 and the fourth contact surface 241 , which is conducive to the rapid transfer of heat to the floor s...

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Abstract

The invention relates to a geothermal floor and a junction structure thereof, and belongs to the technical field of a building decorative material. The geothermal floor is a composite floor, and the body of the geothermal floor is formed by sequentially bonding a decorative surface plate 1, a heat-conducting medium 2 and a substrate 3 by utilizing an adhesive. In the junction structure, the right side of one geothermal floor is connected with the left side of another geothermal floor through a lock catch, wherein, an arc contact surface 241 arranged on the heat-conducting medium in the right side of the geothermal floor and an arc contact surface 231 arranged on the heat-conducting medium in the left side of another geothermal floor form a cavity with a relatively closed section, and the cavity can accommodate a floor heating water pipe or a heating cable so that heat can be quickly transferred to the surface of the floor via the heat-conducting medium, thus achieving the purpose of heating. The heat-conducting medium is preferably an aluminum alloy profile. The geothermal floor and the junction structure thereof have the advantages of fast heating speed, energy conservation and the like, and are convenient in installation and maintenance.

Description

technical field [0001] The invention relates to a geothermal floor and a combined structure, belonging to the technical field of building decoration materials. Background technique [0002] In the prior art, the heat conduction cut-off or heating elements of the geothermal floor are arranged separately from the floor, or are laid on the ground or installed inside other components such as the bottom plate between the ground and the floor, such as a composite geothermal floor (Patent Application No. : CN200510040599.2), it comprises table board, sub-table board, core board, base plate, horizontal heat conduction groove is arranged in core plate, longitudinal heat conduction groove is arranged in base plate, transverse heat conduction groove and longitudinal heat conduction groove are perpendicular to each other and run through, and transverse heat conduction groove The groove and the longitudinal heat conduction groove are filled with heat conduction medium. In the above tech...

Claims

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Application Information

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IPC IPC(8): E04F15/02
Inventor 李增清李渊
Owner 李渊
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