LED Spotlights
A technology of light-emitting diodes and lamp sockets, which is applied to semiconductor devices, lampshades, light sources, etc. of light-emitting elements, can solve the problems of low heat dissipation efficiency and high heat generation of LED lamps, and achieve the effect of improving heat dissipation performance, short heat conduction path and large surface area.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
no. 1 example
[0029] figure 1 An exploded view showing the LED spotlight of the first embodiment of the present invention. refer to figure 1 As shown, the LED spotlight 100 of this embodiment includes a housing 101 , a driver 102 , a cover 103 , a lamp holder 104 , an LED substrate 105 and a lampshade 106 . The housing 101 has an accommodating portion 111 and an opening 112 . The driver 102 is, for example, a printed circuit board (PCB). The driver 102 is disposed in the accommodating portion 111 . The cover body 103 covers the opening 112 for sealing the driver 102 . In an embodiment, the cover body 103 can be buckled into the housing 101 by buckling, and can optionally be assisted in fixing by applying glue.
[0030] The casing 101 is provided with a plurality of arms 113 extending upward from the casing 101 . For example, the arm 113 extends upward from the opening edge of the housing 101 . In the embodiment of the present invention, the specific number of support arms 113 may be ...
no. 2 example
[0043] Figure 8 It shows an exploded view of the light-emitting diode spotlight of the second embodiment of the present invention. Figure 9 It shows the assembly diagram of the LED spotlight of the second embodiment of the present invention. refer to Figure 8 with Figure 9 shown, refer to Figure 8 As shown, the LED spotlight 200 of this embodiment includes a casing 201 , a driver 202 , a cover 203 , a lamp holder 204 , a LED substrate 205 and a lampshade 206 . The housing 201 has an accommodating portion 211 and an opening 212 . The driver 202 is, for example, a printed circuit board (PCB). The driver 202 is disposed in the accommodating portion 211 . The cover body 203 covers the opening 212 for sealing the driver 202 . In an embodiment, the cover body 203 can be snapped into the housing 201 by buckling, and can optionally be assisted in fixing by applying glue.
[0044] The casing 201 is provided with a plurality of arms 213 extending upward from the casing 201 ...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com