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Water-soluble no-clean soldering flux

A no-cleaning and fluxing technology, applied in the direction of welding media, welding equipment, welding/cutting media/materials, etc., can solve the problems of staying and flux in the laboratory stage, etc., and achieve excellent fluxing effect and good spreading process , the effect of reducing investment

Inactive Publication Date: 2011-05-11
广东剑鑫科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the research on no-clean flux in our country mainly stays at the level of less than 20% residue. For the residue less than 10%, there are only relevant introductions in some patents, and the flux with lower residue The development is currently in the laboratory stage

Method used

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  • Water-soluble no-clean soldering flux
  • Water-soluble no-clean soldering flux

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] This is a water-soluble no-clean flux containing non-ionic surfactants. The content percentage of each raw material is:

[0036] Acrylic Activator: 2.20%

[0037] Benzotriazole: 0.30%

[0038]OP-10: 0.20%

[0039] Diethyl succinate: 2.00%

[0040] Dimethyl adipate: 2.00%

[0041] Diethylene glycol monobutyl ether: 5.00%

[0042] Polymethylsiloxane: 0.30%

[0043] Deionized water 88.00%.

Embodiment 2

[0045] This is a water-soluble no-clean flux containing defoaming agent. The content percentage of each raw material is:

[0046] Acrylic Activator: 3.50%

[0047] Triethylamine: 0.70%

[0048] TX-10: 0.30%

[0049] Butyl acetate: 2.00%

[0050] Amino acid ester 1.00%

[0051] Diethylene glycol monomethyl ether: 2.00%

[0052] Diethylene glycol monobutyl ether: 1.60%

[0053] Polyoxypropyl glyceryl ether: 0.20%

[0054] Deionized water 88.70%.

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Abstract

The invention relates to a water-soluble no-clean soldering flux which comprises the following components in percentage by weight: 2.0-3.7% of crylic acid activator, 0.1-0.5% of surfactant, 1.5-5.0% of ester wetting agent, 2.0-15.0% of ester cosolvent, 0.05-1.0% of antioxidant, 0.03-0.5% of antifoaming agent, and the balance of deionized water. The soldering flux provided by the invention is scientifically designed and reasonably prepared, and has the advantages of good solderability and high insulation resistance, does not contain halogen or VOC (volatile organic compound) substance or need to be cleaned, is environment-friendly soldering liquid, has less possibility of combustion, and does not explode; and in the water-soluble no-clean soldering flux, the deionized water is utilized as solvent.

Description

technical field [0001] The product of the invention relates to the field of electronic materials, in particular to a water-soluble no-cleaning flux. technical background [0002] At present, the solder liquid used in the electronic DIP industry uses low-boiling alcohols such as ethanol, methanol, and isopropanol as solvent carriers. These alcohols are volatile organic compounds (VOC), and the gases of these organic compounds have certain Toxicity, if emitted into the air, it will cause pollution. According to environmental protection requirements, it is a substance that is gradually banned. Furthermore, these alcohols are all flammable substances, which can easily cause fires in use and bring inevitable hidden dangers to safe production. In addition, organic alcohols are important chemical raw materials. It is a waste to volatilize a large amount of them as solvent carriers. It is the development trend of solder liquid to replace VOC with deionized water. [0003] No-clean...

Claims

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Application Information

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IPC IPC(8): B23K35/362B23K35/363
Inventor 邓剑明
Owner 广东剑鑫科技股份有限公司
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