Glue spraying processing device used in semiconductor manufacturing
A processing device and semiconductor technology, which is applied to liquid injection devices, devices for processing microstructures, devices for coating liquids on surfaces, etc., can solve problems such as inability to meet manufacturing requirements, achieve simple and ingenious structures, and ensure uniformity
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[0024] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.
[0025] Such as Figure 1-2 As shown, the glue spray processing device of the present invention mainly includes: a linear actuator 1, a nozzle 2, a protective cup 3, a slide table 4, a unit base 5, a rotating motor 6, a conductive slip ring 7, a timing belt 8, and a bracket 9 , exhaust duct 10, vacuum chuck 11, etc., the unit base surface 5 is provided with a protective cup 3, a slide table 4, a vacuum chuck 11, and the slide table 4 and the vacuum chuck 11 are arranged on the inner side of the protective cup 3, and the slide The table 4 is used to place the wafer, and a vacuum chuck 11 is arranged on the bottom of the wafer, and the vacuum chuck 11 is located at the center of the loading table 4 . A linear actuator 1 is provided above the unit base surface 5 , and the nozzle 2 is installed on the linear actuator 1 . Below the unit base surface 5, a ro...
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