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Double-solidification system fast-flowing underfill and preparation method thereof

An underfill, dual-curing technology, used in chemical instruments and methods, adhesives, epoxy resins, etc., can solve the problems of non-curing glue and poor compatibility, and achieve fast flow speed, low shrinkage, low odor effect

Inactive Publication Date: 2013-04-17
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But at the same time, there are also some defects. Due to the poor compatibility between the glue and some fluxes, some glues may not be cured.

Method used

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  • Double-solidification system fast-flowing underfill and preparation method thereof
  • Double-solidification system fast-flowing underfill and preparation method thereof
  • Double-solidification system fast-flowing underfill and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] Accurately weigh the following raw materials, 40 g of 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexyl carboxylate, bis(7-oxabicyclo[4.1.0]3-heptylmethyl) 40g of adipate and 0.5g of Super XC-7231 hexafluoroantimonate from King Company of the United States were put into the reaction kettle, mixed at 30°C for 30 minutes to dissolve into a homogeneous solution, and then 10g of acrylic epoxy resin, acrylic acid 5 g of butyl ester, 3 g of 1,4-butanediol, 1 g of β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 0.3 g of benzoyl peroxide, and 0.2 g of carbon black. The temperature was controlled at 15° C., the degree of vacuum was -0.05 MPa, and the number of revolutions was 500 rpm, and the mixture was stirred and mixed in vacuum for 2 hours to obtain a uniform product.

Embodiment 2

[0038] Accurately weigh the following raw materials, 50g of bis(7-oxabicyclo[4.1.0]3-heptylmethyl) adipate, 20g of bisphenol A epoxy resin, and hexafluoroantimonate from the King Company of the United States. Put 3g of K-PURE CXC-1612 into the reaction kettle, mix at 35°C for 30 minutes to dissolve it into a homogeneous solution, then add 10g of acrylic epoxy resin, 8g of isooctyl acrylate, 6.5g of polycaprolactone polyol, γ-glycidyloxypropyltrimethoxysilane 2g, azobisisobutyronitrile 0.3g, carbon black 0.2g; control temperature at 15°C, vacuum degree -0.05MPa, rotation speed 1000 rpm, vacuum Mixing was stirred for 2 hours to obtain a homogeneous product.

[0039] Wherein, the structural formula of described bisphenol A type epoxy resin is:

[0040]

[0041] n is a mixture of compounds consisting of 0, 1, 2-18, and 19.

Embodiment 3

[0043] Accurately weigh the following raw materials, bis(7-oxabicyclo[4.1.0]3-heptylmethyl)adipate 30g, hexafluoroantimonate is K-PURE CXC-1612 1g input from King Company of the United States In the reaction kettle, mix at 30°C for 30 minutes to dissolve it into a uniform solution, then add 15g of acrylic epoxy resin, 30g of lauryl methacrylate, 20g of polyester polyol, 3g of γ-mercaptopropyltrimethoxysilane, 0.5 g of di-tert-butyl peroxide and 0.5 g of carbon black; the temperature was controlled at 15°C, the degree of vacuum was -0.07 MPa, the number of revolutions was 700 rpm, and the mixture was stirred and mixed in vacuum for 2 hours to obtain a uniform product.

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Abstract

The invention discloses a double-solidification system fast-flowing underfill and a preparation method thereof. The underfill comprises the following raw materials in parts by weight: 30-80% of epoxy resin, 10-50% of epoxy acrylate, 5-30% of acrylate, 2-20% of polyol, 1-20% of silane coupling agent, 0.3-4% of cationic initiator, 0.1-3% of radical initiator and 0.1-0.5% of carbon black; and the preparation method comprises the following steps of: weighing the epoxy resin and the cationic initiator in the proportion, putting in a reaction kettle and stirring into a uniform solution; weighing the epoxy acrylate, the acrylate, the polyol, the silane coupling agent, the radical initiator and the carbon black in the proportion, putting in the reaction kettle in sequence, mixing and stirring to obtain the finished product of the double-solidification system fast-flowing underfill.

Description

technical field [0001] The invention relates to a dual-curing system fast-flowing underfill adhesive and a preparation method thereof, which is suitable for underfilling of packages such as chip size packaging (CSP) and ball grid array packaging (BGA), and belongs to the field of adhesives. Background technique [0002] With the rapid development of the electronics industry, the closely related electronic packaging technology is becoming more and more advanced. Intelligence, light weight, small size, fast speed, strong function, and good reliability have become the main development trends of electronic products. In order to adapt to the development of this trend, flip-chip technology has been produced. Key benefits of flip-chip include shrinkability and space savings, in addition to shorter and lower inductance interconnect paths, high I / O density, rework and self-alignment capabilities. Flip-chip performance is also outstanding for thermal management. The underfill is on...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/10C09J163/00C09J163/02C09J163/04C09K3/10
Inventor 王红娟王建斌陈田安
Owner YANTAI DARBOND TECH
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