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Molybdenum target welding method

A welding method and target technology, which are used in welding equipment, metal processing equipment, manufacturing tools, etc., can solve the problems of large deformation, low welding strength, unable to meet the requirements of sputtering process, etc., to suppress deformation and improve welding strength. , reduce the effect of relative deformation

Inactive Publication Date: 2011-04-13
KONFOONG MATERIALS INTERNATIONAL CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] The present invention is made to solve the problems that the welding strength between the molybdenum or molybdenum alloy target and the copper back plate is low, which cannot meet the requirements of the sputtering process, and will cause large deformation when the target area is large.

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Embodiment Construction

[0027] The inventors of the present invention found that after welding the existing molybdenum or molybdenum alloy target components and the back plate, especially the copper back plate, the welding quality cannot meet the high strength requirement of the sputtering process.

[0028] The invention provides a welding method for a target assembly, which includes: providing a molybdenum or molybdenum alloy target, a back plate and solder; performing nickel plating on the joint surface of the molybdenum or molybdenum alloy target; coating the molybdenum or molybdenum alloy Preheating the target, so that the solder is distributed on the joint surface of the molybdenum or molybdenum alloy target; preheating the back plate, so that the solder is distributed on the joint surface of the back plate; making the molybdenum or molybdenum alloy The bonding surface of the target is attached to the bonding surface of the back plate and welded to form a target assembly; the target assembly is c...

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Abstract

The invention relates to a molybdenum target welding method, which comprises the following steps of: providing a molybdenum or molybdenum alloy target, a backing plate and a solder; plating nickel on the joint surface of the molybdenum or molybdenum alloy target; preheating the molybdenum or molybdenum alloy target to ensure that the solder is distributed on the joint surface of the molybdenum or molybdenum alloy target; preheating the backing plate to ensure that the solder is distributed on the joint surface of the backing plate; adhering the joint surface of the molybdenum or molybdenum alloy target to the joint surface of the backing plate, and welding to form a target component; and cooling the target component. According to the molybdenum target welding method, the molybdenum or molybdenum alloy target and the backing plate, particularly a copper backing plate can be combined together with high strength, so that the requirement of a sputtering process on high strength is met; and even if the target has large area, the target component, particularly the molybdenum or molybdenum alloy target also can be effectively prevented from being greatly deformed, warped and the like.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a welding method for molybdenum targets. Background technique [0002] Sputtering coating is a common process in semiconductor production. In the sputtering coating process, the target material used for sputtering is usually fixed with a back plate, that is, the target material is connected to the back plate by means such as welding and bolting. to fix. Here, the target used for sputtering and the back plate used to fix the target connected together are called a target assembly, and the back plate is used to assemble the target to the sputtering base, and It also has the effect of conducting heat. [0003] Due to the different target materials, the type of solder used in welding, welding conditions, etc. are also different. In addition, the backplanes widely used in production are mainly copper targets. At present, indium-based and tin-based solders are mainly used ...

Claims

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Application Information

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IPC IPC(8): B23K1/00B23K1/20B23K1/19B23K1/06
Inventor 姚力军潘杰王学泽李响
Owner KONFOONG MATERIALS INTERNATIONAL CO LTD
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