Novel production method of board deep-recess line

Abstract

The invention discloses a novel production method of a board deep-recess line, comprising the following steps of: (A) performing board cutting, inner-layer multibond, inner-layer graph transferring and press plate processing on a circuit board substrate by using a negative film etching method, and then drilling; (B) performing whole-board copper deposition electroplating or board-adding electroplating; (C) covering a hole with a dry film after the whole-board electroplating; (D) performing second exposure and development processing through a line film; (E) performing acidic etching processingon the developed outer-layer line; and (F) performing tin-removing processing on the circuit board obtained in the step (E), detecting whether the circuit board is qualified, and obtaining the finished product. The invention aims at providing a novel production method of the board deep-recess line by using the negative film etching method, using a dry film to cover hole after the whole-board electroplating, using a silk-screen wet film (liquid-state photoactive ink) or a coating wet film to prepare the board deep-recess line through twice exposure and development, thereby the defect in the prior art is overcome.

Description

technical field [0001] The invention belongs to the technical field of circuit board manufacturing technology, and in particular relates to a novel method for manufacturing circuit boards with deep depressions. Background technique [0002] When the circuit board needs to make a circuit on a copper surface with a concave surface, because of the uneven surface, there is no way to stick to the dry film, causing the liquid to penetrate into the bottom of the dry film when the circuit is etched, and the circuit is etched open. Rigid-flex boards are prone to the problem of soft board sags in the position of blind slots. When the soft boards are dented, it is difficult to make circuits. [0003] The principle of circuit board negative film etching is: after the negative film is produced, the required circuit or copper surface is transparent, and the unnecessary part is black. It is chemically hardened, and the next development process will wash away the unhardened dry film, so in...

AI Technical Summary

Problems solved by technology

[0002] When the circuit board needs to make a circuit on a copper surface with a depression on the surface, because the surface is uneven, there is no way to stick to the dry film, causing the liquid to penetrate into the bottom of the dry film when the circuit is etched, and the circuit is etched open.

Rigid-flex boards are prone to the problem of soft board sag in the position of the blind groove. When the soft board is dented, it is difficult to make the circuit