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Method for preparing plane hollow microneedle for transdermal administration

A hollow micro- and micro-needle technology, used in micro-needles, processes for producing decorative surface effects, and pharmaceutical devices, etc. The polymer is easy to fall off and other problems to achieve the effect of enhancing drug delivery efficiency, reducing process complexity, and long-term delivery

Inactive Publication Date: 2010-12-08
PEKING UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The microneedles prepared by electroplating have weak bonding force with the substrate, and the deposited polymer is also easy to fall off, and the overall reliability and ease of use need to be improved.

Method used

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  • Method for preparing plane hollow microneedle for transdermal administration
  • Method for preparing plane hollow microneedle for transdermal administration
  • Method for preparing plane hollow microneedle for transdermal administration

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Embodiment Construction

[0030] Below in conjunction with the accompanying drawings, the present invention is further described in detail through the embodiments, but the scope of the present invention is not limited in any way.

[0031] Through mechanical processing of chemically pure titanium materials, four-inch titanium-based wafers are prepared by wire cutting. Low-temperature vacuum annealing and chemical-mechanical polishing are performed to obtain a 200 μm thick four-inch titanium-based wafer polished on both sides or one side. Using this titanium-based disc to prepare planar hollow microneedles according to the following steps:

[0032] 1. Form a microneedle channel

[0033] A double-sided polished titanium-based wafer was taken as the first titanium substrate 1, and a 15 μm-thick SU83010 photoresist 2 was spin-coated on one side of the polished surface, and left to stand for 24 hours. After pre-baking on a hot plate (from 45°C to 95°C for 2 minutes at every 10°C for 10 minutes, then cool d...

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Abstract

The invention discloses a method for preparing a plane hollow microneedle for transdermal administration, which comprises the following steps of: defining a microneedle flow channel pattern on one surface of a first metal substrate to form a trench, and defining a microneedle pattern on the other surface to form a cutting sign, wherein the central axis of the flow channel pattern is aligned with that of the microneedle pattern; bonding a second metal substrate with a trench surface of the first metal substrate; thinning a non-bonding surface of the second metal substrate, and allowing the cutting sign on the first metal substrate to align with and transfer to the non-bonding surface of the second metal substrate; and thinning a non-bonding surface of the first metal substrate, and cutting by aligning with the cutting sign on the second metal substrate to form the plane hollow microneedle. Based on the micromachining technology and by combining the conventional technology of machining and cutting at the same time, the method reduces the process difficulty, increases the using reliability of the microneedle, and is favorable for quantity production.

Description

technical field [0001] The invention relates to micromachining technology, in particular to a method for preparing a planar hollow microneedle for transdermal drug delivery. Background technique [0002] At present, the main modes of administration are oral and injection. Due to the absorption in the stomach and the first-pass effect of the liver, the actual efficacy of the drug on the site of action is greatly affected by the oral drug. Injection will not only bring obvious pain to patients, but also requires professional operation, and may even cause local skin damage or even infection, which is not suitable for long-term and precise controlled sustained-release drug delivery. [0003] Transdermal administration is a better solution. The skin is divided into three layers from outside to inside: stratum corneum, epidermis and dermis. The stratum corneum is about 10-20 microns thick and is a layer of dead tissue without blood vessels and nerves; the epidermis is located a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B81C1/00A61M37/00
CPCA61M37/0015A61M2037/003A61M2037/0053
Inventor 陈兢李文
Owner PEKING UNIV
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