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Silica-based condenser microphone and production method thereof

A condenser microphone and a technology of a manufacturing method, applied to electrical components, electrostatic transducers, microphones, sensors, etc., can solve the problems of small insulation resistance between the diaphragm and the backplane, improve electrical performance, avoid contact resistance, and solve leakage problems Effect

Inactive Publication Date: 2010-09-29
AAC ACOUSTIC TECH (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

With the reduction of the size of the silicon-based condenser microphone, the defect of the traditional manufacturing method of the silicon-based condenser microphone is that the insulation resistance between the diaphragm and the back plate is small

Method used

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  • Silica-based condenser microphone and production method thereof
  • Silica-based condenser microphone and production method thereof
  • Silica-based condenser microphone and production method thereof

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Embodiment Construction

[0022] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0023] The silicon condenser microphone 1 provided by the present invention is mainly used in electronic devices such as mobile phones for receiving sound.

[0024] The manufacture method of the silicon-based condenser microphone provided by the invention, the method comprises the following steps:

[0025] Step A: providing a silicon substrate, and depositing an etching stopper layer on the silicon substrate;

[0026] Step B: depositing a stress balance layer on the etch stop layer;

[0027] Step C: depositing a diaphragm on the stress balance layer;

[0028] Step D: depositing a sacrificial layer on the silicon substrate, and engraving a latent image;

[0029] Step E: depositing the backplane;

[0030] Step F: Doping the backplane to make it a conductor;

[0031] Step G: etching the backplane;

[0032] Step H: Deposit electrodes and make ohmic co...

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Abstract

The invention relates to a method for producing a silica-based condenser microphone. The method comprises the following steps of: A. providing a silicon substrate, and depositing an etching barrier layer on the silicon substrate; B. depositing a stress balancing layer on the etching barrier layer; C. depositing a vibrating diaphragm on the stress balancing layer; D. depositing a sacrificial layer on the silicon substrate, and etching latent images; E. depositing a backplate; F. caying out doping on the backplate to form a conductor; G. etching the backplate; and H. depositing an electrode, and performing ohmic contact.

Description

technical field [0001] The invention relates to a method for manufacturing a silicon-based condenser microphone. Background technique [0002] With the development of wireless communication, there are more and more mobile phone users around the world. The requirements of users for mobile phones are not only satisfied with calls, but also to be able to provide high-quality call effects. Especially the current development of mobile multimedia technology, the mobile phone Call quality is more important. The microphone of a mobile phone is used as a voice pick-up device for the mobile phone, and its design directly affects the call quality. [0003] Micro-Electro-Mechanical-System Microphone (MEMS for short) is currently the most widely used microphone with better performance. In the related art, the MEMS microphone includes a base, a back plate and a diaphragm. With the reduction of the size of the silicon-based condenser microphone, the disadvantage of the traditional manufac...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R31/00H04R19/04
Inventor 孟珍奎葛舟李海锋
Owner AAC ACOUSTIC TECH (SHENZHEN) CO LTD
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