Frame laminate material and application thereof in preparing membrane electrode with sealed frame core component
A laminated material with sealing technology, applied to battery electrodes, battery pack components, circuits, etc., can solve the problems of mechanical damage, aggravate mechanical damage, damage, etc.
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Embodiment 1
[0078] 1) The edges on both sides of the frame laminate material used are parallel, and the thicknesses of the supporting film, the first adhesive layer, the frame film, the second adhesive layer and the protective film are respectively 100 μm, 10 μm, 20 μm, 10 μm, and 20 μm. The first adhesive layer and the second adhesive layer are adhesives. Punch out the frame stack, let the knife mold be perpendicular to the frame stack, punch out the active area from the side of the protective film to the side of the support film, the punching depth is 80-140 μm, the punching area is rectangular, the size is 50x50mm, Two of the edges of the active area are parallel to the edges on both sides of the frame laminate material, with a distance of 25 mm. After blanking is completed, keep the layers in the active area of the frame laminate from peeling off;
[0079] 2) Peel off the first protective film of the Nafion212 film lamination with a width of 100mm by DuPont Company, and keep the se...
Embodiment 2
[0090] 1) The edges on both sides of the frame laminate material used are parallel, and the thicknesses of the supporting film, the first adhesive layer, the frame film, the second adhesive layer and the protective film are 150 μm, 10 μm, 20 μm, 10 μm, and 20 μm, respectively, The first adhesive layer and the second adhesive layer are adhesives, wherein the adhesive of the first adhesive layer is in a special state, and will not bond after being in contact with the polymer ion exchange membrane, and it will not be bonded when peeled off. There will be no partial or total attachment of the binder to the polymeric ion exchange membrane. Punch out the frame stack, make the knife edge of the knife die perpendicular to the stack plane, and punch out the active area from the side of the protective film to the side of the support film. The punching depth is 80-180 μm, the punching area is rectangular, and the size is 50x50mm, two edges of the active area are parallel to the edges on ...
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