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Heat exchange plate with alternate intercommunicating microchannel net structure and manufacturing method thereof

A network structure, interlaced technology, applied in the direction of heat exchange equipment, lighting and heating equipment, laminated components, etc., can solve the problems of difficult large-scale use, miscellaneous spraying deposition methods, etc., to achieve high cost and increase specific surface area , the effect of excellent boiling enhancement performance

Inactive Publication Date: 2010-07-21
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Ngai adopts the sputtering deposition method and other characteristics, which are difficult to use on a large scale

Method used

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  • Heat exchange plate with alternate intercommunicating microchannel net structure and manufacturing method thereof
  • Heat exchange plate with alternate intercommunicating microchannel net structure and manufacturing method thereof
  • Heat exchange plate with alternate intercommunicating microchannel net structure and manufacturing method thereof

Examples

Experimental program
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Effect test

Embodiment

[0033] Taking the processing of 2mm thick, 0.4mm microchannel width, 0.4mm fin width, and aluminum bronze substrate as an example, the process is as follows:

[0034] (1) Fix the thin plate to be processed on the indexing head of the milling machine with a fixture, and adjust the angle between the workpiece edge and the main shaft by adjusting the indexing head to realize the processing of microchannels at any angle on the workpiece. In this example, choose 45 degrees, that is, as figure 1 The channel shown is at a 45 degree angle to the sideline.

[0035] (2) First, use multiple superimposed milling cutters on one side of the board (such as figure 2 ) is processed by milling the micro-channel array by interval jumping method to improve the precision. Such as Figure 4 The microchannel array shown is not processed sequentially from front to back, but is processed by pressing multiple milling cutters with a large-thickness tool shim (in this example, the thickness is 3 ribs ...

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Abstract

The invention discloses a heat exchange plate with an alternate intercommunicating microchannel net structure and a manufacturing method thereof. Both surfaces of the heat exchange plate are provided with microchannels which are vertical to one another; the depth of the microchannels is 1 / 2 to 2 / 3 of the thickness of a thin plate; the microchannels form the intercommunicating net structure; the width of the microchannels is between 0.1 and 1mm; the width of fins among the microchannels is between 0.4 and 0.8mm; and the thickness of the thin plate is between 1 and 3mm. During processing, the thin plate to be processed is fixed on an indexing head of a milling machine with a clamp; one surface of the thin plate is processed by using a plurality of sheets of superposed milling cutters; through the movement of a main shaft of the milling machine, the depth of the microchannels and the distance among the microchannels are controlled; and then the other surface of the thin plate is processed to ensure that an upper channel is vertical to a lower channel so as to finally form the intercommunicating microchannels. The heat exchange plate of the invention can increase the specific surface area and is beneficial for nucleation. The groove is beneficial for the air bubbles to overflow. The heat exchange plate of the invention has excellent boiling reinforcing performance. The method for manufacturing the heat exchange plate adopts the plurality of sheets of milling cutters to carry out processing, thus, the processing efficiency is greatly improved and the cost is reduced.

Description

technical field [0001] The invention relates to a heat exchange plate, in particular to a heat exchange plate with a network structure of staggered intercommunicating micro-channels and a manufacturing method thereof, which are applied in the field of heat dissipation. Background technique [0002] The heat dissipation problem has always affected the performance and service life of the product. With the development of science and technology, the integration of various products is getting higher and higher, and the system is becoming more and more complex. Modern people prefer small and compact items. Various factors lead to heat dissipation problems. getting bigger. Especially in the field of electronics, the highest heat flux has exceeded 1×106W / m2. Elevated temperatures can degrade product performance, reliability, and safety. It can be seen that excellent heat dissipation technology not only saves energy, improves product quality and service life, but also indirectly af...

Claims

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Application Information

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IPC IPC(8): F28F3/12
Inventor 汤勇贺占蜀李长春丁鑫锐潘敏强万珍平周伟
Owner SOUTH CHINA UNIV OF TECH
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