Stable single-component epoxy surface mount adhesive in room temperature storage and preparation method thereof

Abstract

The invention discloses a stable single-component epoxy surface mount adhesive in room temperature storage and a preparation method thereof. The surface mount adhesive comprises the following components according to parts by weight: 30-45 parts of epoxy resin, 10-25 parts of epoxy diluent, 20-35 parts of latent curing agent, 0.5-2.0 parts of stabilizer, 5-15 parts of thixotropic agent, 15-30 parts of filler and 0.1-1.0 part of pigment. The preparation method comprises the following steps: (a) adding the epoxy resin, reactive diluent, the filler, the pigment and the stabilizer into a reactor for uniform mixing sequentially; (b) adding the latent curing agent into the above mixture for uniform mixing; and (c) adding the thixotropic agent for uniform dispersing and vacuum defoaming treatment.

Description

technical field [0001] The invention relates to an adhesive for surface mounting in the electronic industry, in particular to a one-component epoxy patch adhesive with room temperature storage stability and a preparation method thereof. Background technique [0002] With the development of the electronics industry, electronic appliances are developing toward miniaturization, light weight, multi-function, and high performance, and the application of surface mount technology SMT is becoming more and more common. Surface mount technology SMT, its process involves a variety of adhesive materials, such as patch glue for fixing components, sealant for positioning coils and some components, plug-in glue for temporarily bonding surface assembly components, etc. Among these adhesives, the most important thing for the SMT process is the patch adhesive, which mainly uses printing or pin dot patterns, cured by reflow soldering, and sticks the chip electronic components to a specific pos...

AI Technical Summary

Problems solved by technology

Although latent curing agents on the market that can achieve rapid curing at medium temperatures have certain latent properties at low temperatures, they will still release organic amines at room temperature, which will increase the viscosity of the patch adhesive and affect the use

Especially when combined with low-viscosity resins such as diluents, the release rate of organic amines is accelerated, resulting in unsatisfactory storage stability of patch adhesives at room temperature. Higher requirements are put forward for storage and storage, which affects the use of customers, resulting in shortened service life or failure of patch adhesives, resulting in economic waste

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