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Organic silica gel packaging material of large-power LED and preparation method thereof

A silicone gel sealing, high-power technology, applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of low use efficiency, cracks, light transmittance reduction, etc.

Inactive Publication Date: 2010-06-02
陈俊光
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Such as Chinese Patent Publication No. 101289538A, discloses the preparation method of organosilicon hydrogen-containing silicone oil, but does not involve the preparation of encapsulation gel; Preparation of gel-type encapsulant; Chinese Patent Publication No. CN101381516A discloses the preparation of LED room temperature vulcanized silicone encapsulant, and does not involve the preparation of gel
[0007] The existing silicone gel uses linear polyorganosiloxane to reduce the crosslinking point to form softness. It is easy to precipitate free low molecular weight at high temperature, and the purity is low, and it is easy to produce yellow under high temperature conditions. harden, crack
It will reduce the transparency and light transmittance of high-power LED light sources, which will directly affect the optical performance and heat dissipation effect of LEDs; it will reduce the service life of LED light sources; and there are only two-component packaging forms, and the actual use effect is low
Totally unsuitable for high-power LED packaging

Method used

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  • Organic silica gel packaging material of large-power LED and preparation method thereof
  • Organic silica gel packaging material of large-power LED and preparation method thereof
  • Organic silica gel packaging material of large-power LED and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0075] Example 1 : the preparation of the single-component silica gel product of the present invention

[0076] Synthesis and purification of component A:

[0077] 1. Raw materials ①Octamethylcyclotetrasiloxane, referred to as D4, is distilled to take the middle part (head and tail removed), with a purity of about 99.9%.

[0078] ② The mixed ring body (liquid) of diphenylhexamethylcyclotetrasiloxane and tetraphenyltetramethylcyclotetrasiloxane, take the distillate in the range of 236-256℃ / kpa. The refraction is between 1.49-1.53, colorless and transparent, and can be used immediately after distillation.

[0079] ③Hexamethyldisiloxane, referred to as MM, is distilled to take the middle part (head and tail removed), with a purity of over 99.2%.

[0080] ④1. Vinyl 1.1.3.3.3 Pentamethyldisiloxane, used for rectification, instant distillation. The purity is about 99% (subject to gas chromatography test)

[0081] *All raw materials must be used after rectification, must be dist...

Embodiment 2

[0100] Synthesis and purification of component A: changing the structure of the end-capping agent to increase the organopolysiloxane with T-type structure

[0101] 1. Selection of raw materials

[0102] ①Hexamethyldisiloxane and methyl D4, rectified, take the middle part, the purity is above 99.8%

[0103] ②1. Vinyl 1.1.3.3.3 Pentamethyldisiloxane, the middle part is taken after rectification, and the purity is >99%

[0104] ③CH3Si(OEt3)3 after rectification to get about 99.5% product

[0105] All the above-mentioned raw materials are ready to be used by distillation, and the purity is more than 99.2% by chromatographic tracking.

[0106] 2. A reaction synthesis, ① first synthesize the product of CH3Si[OSi(CH3)2R]3, R1=CH3 or CH2=CH. In the flask, add methyltriethoxysilane, then add vinyl and methyl respectively A total of 3 moles of the head-sealing agent is added, and toluene is added to be 1 / 2 of the total amount of siloxane, and stirred. Then add CF3SO3H catalyst 1.2‰,...

Embodiment 3

[0144] Example 3: The preparation of the two-component silicone gel product of the present invention (add the silicone gel made of MQ resin filler) Synthesis and refining of component A:

[0145] A material raw material preparation

[0146] (1) a.w-divinyl polydimethylsiloxane with viscosity ((25°C) 950mpa.s, structural formula:

[0147] (1) (Viscosity) (25°C) 950mpa.s α-ω-=vinyl poly=methyl siloxane structural formula

[0148] m=260

[0149] The reaction crude product was refined to remove odor and low molecular weight, and after filtration, a transparent and colorless product with high purity was obtained for future use, with a refractive index of 1.406.

[0150] (2) Viscosity (25°C) 930mPa.s, the molecular end part is (CH3)2(CH=CH2)SiO 1 / 2, the chain link is blocked, and the other part and the second end are (CH3)3SiO 1 / 2 end-blocked polyorganosiloxane.

[0151] The crude product is refined to deodorize and remove low-molecular substances. After filtration, a trans...

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Abstract

The invention relates to organic silica gel for packaging a large-power LED and a preparation method thereof. The gel is prepared by mixing a component A of vinyl-contained polysiloxane, a silicon resin component B, a component C of hydrogen-contained polymethylsiloxane, a platinum catalyst component D, a catalytic inhibiting agent component E and a thickening agent component F, and the obtained packaging gel with different refractive rates of 1.4 grade, 1.5 grade, and the like is used for packaging various types of large-power LEDs or is used as other optical purposes. By adopting the component B as a filling material, the invention solves the problems of temperature resistance, color change, light transmittance and needle penetration reduction of the large-power LED product, can be made into two packaging types of a single component and double components, improves the adaptability on packaging equipment and the manufacture procedure and the efficiency, reduces the cost and is convenient for use.

Description

(1) Technical field [0001] The invention relates to a packaging material for high-power LEDs, in particular to an organic silicon gel packaging material for high-power LEDs and a preparation method thereof. (2) Technical background [0002] Ultra-brightness light-emitting diode (LIGHE EMITTING DIODE referred to as LED) is a kind of electroluminescent solid-state device. Compared with traditional incandescent lamps, fluorescent lamps, and high-intensity gas discharge lamps, LEDs have the advantages of very small operating current, no environmental pollution, simple structure, high brightness, small size, and long service life. Especially the successful development of white LED, high-power LED production has become a fact. In a short time, the main body of the fourth-generation light source will be formed. [0003] It can be seen from the structure of the LED illuminant that the LED chip is bonded to the matrix material and connected to the external electrodes through the le...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/07C08L83/05H01L33/56
Inventor 陈俊光
Owner 陈俊光
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