Photosensitive resin composition, photosensitive element, method of forming resist pattern, and process for producing printed wiring board

A resin composition and photosensitivity technology, which is applied in the direction of printed circuit manufacturing, printed circuit, photoplate making process of patterned surface, etc., can solve the problems of reducing the performance of resist, entrapment of air, messy resist image, etc. To achieve the effect of excellent electrical characteristics

Active Publication Date: 2012-07-18
RESONAC CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the case of a dry film photosensitive resist, air is easily entrapped and air bubbles are generated during thermocompression bonding to the base material, resulting in decreased adhesion and disordered resist images, which may degrade the resist performance

Method used

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  • Photosensitive resin composition, photosensitive element, method of forming resist pattern, and process for producing printed wiring board
  • Photosensitive resin composition, photosensitive element, method of forming resist pattern, and process for producing printed wiring board
  • Photosensitive resin composition, photosensitive element, method of forming resist pattern, and process for producing printed wiring board

Examples

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Effect test

Embodiment

[0193] The present invention will be described more specifically below based on Examples and Comparative Examples, but the present invention is not limited to the following Examples.

Synthetic example 1

[0195] Add YDF2001 (manufactured by Dongdu Chemical Co., Ltd., bisphenol F type epoxy resin, Y in general formula (6) 2 = glycidyl, R 12 = hydrogen atom compound) 475 mass parts, acrylic acid 72 mass parts, hydroquinone 0.5 mass parts, carbitol acetate 120 mass parts, heated and stirred at 90 degreeC, and dissolved the reaction mixture. Next, the obtained solution was cooled to 60 degreeC, 2 mass parts of benzyltrimethylammonium chlorides were added thereto, and it heated at 100 degreeC and was made to react until the solid content acid value was 1 mgKOH / g. Furthermore, 98 mass parts of maleic anhydrides and 85 mass parts of carbitol acetates were added, and it heated at 80 degreeC and was made to react for about 6 hours. Subsequently, it was cooled to room temperature and diluted to a solid content concentration of 60% by mass with carbitol acetate to obtain a carboxylic acid-modified bisphenol F type epoxy acrylate (hereinafter referred to as "epoxy resin A1") as (A) compon...

Synthetic example 2

[0197] Add YDCN704 (manufactured by Dongdu Chemical Co., Ltd., cresol novolak type epoxy resin, Y in general formula (5) 1 = glycidyl, R 11 =Methyl compound) 220 mass parts, acrylic acid 72 mass parts, hydroquinone 1.0 mass parts, carbitol acetate 180 mass parts, heated and stirred at 90 degreeC, and dissolved the reaction mixture. Next, the obtained solution was cooled to 60 degreeC, 1 mass part of benzyltrimethylammonium chloride was added to this, and it heated at 100 degreeC and was made to react until the solid content acid value was 1 mgKOH / g. Furthermore, 152 mass parts of tetrahydrophthalic anhydrides and 100 mass parts of carbitol acetates were added, and it heated at 80 degreeC and was made to react for about 6 hours. Subsequently, it was cooled to room temperature and diluted to a solid content concentration of 60% by mass with carbitol acetate to obtain a carboxylic acid-modified cresol novolak type epoxy acrylate (hereinafter referred to as "epoxy resin") as (A) ...

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Abstract

A photosensitive resin composition comprising (A) an acid-modified vinyl-containing epoxy resin, (B) a photopolymerization initiator containing a compound having an oxime ester bond and (C) a sensitizer containing any of coumarin compounds of the following general formula (1).

Description

technical field [0001] The present invention relates to a method for forming a photosensitive resin composition, a photosensitive element, a resist pattern, and a printed circuit board. Background technique [0002] In the past, permanent mask resists in the manufacture of printed circuit boards were produced by screen printing heat-curable resist inks or UV-curable resist inks. In recent years, with the high integration of electronic devices, high-definition wiring patterns and insulating patterns are required in printed circuit boards. However, in the conventional resist forming method by screen printing, it is difficult to form a high-definition resist image because bleeding, dripping, etc. occur during printing. Therefore, in order to form a high-definition resist image, a resist image forming method using a photolithography method has been developed. Specifically, the method is as follows: hot-pressing dry film photosensitive resist onto the substrate, or curtain coat...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/031G03F7/004G03F7/027H05K3/06H05K3/18
CPCG03F7/027G03F7/031H05K3/06
Inventor 佐藤邦明吉野利纯大川昌也日高敬浩立木秀康
Owner RESONAC CORPORATION
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