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High-temperature curing adhesive for bonding electric insulators and preparation method thereof

A high-temperature curing and adhesive technology, applied in the directions of adhesives, adhesive types, adhesive additives, etc., can solve the problems of lack of glue on the bonding surface, decreased electrical resistance of the bonding interface, defects, etc., to ensure safe use. , the effect of reducing stress

Inactive Publication Date: 2010-01-27
CHINA XD ELECTRIC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The result of this kind of sagging defect is: on the one hand, it is easy to cause the adhesive surface to lack glue, resulting in a decrease in the electrical resistance of the bonding interface;

Method used

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  • High-temperature curing adhesive for bonding electric insulators and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] In the present embodiment, the raw material composition of adhesive is as follows:

[0032] Bisphenol A epoxy resin: 100 parts by weight;

[0033] Methyltetrahydrophthalic anhydride: 80 parts by weight;

[0034] Polysulfide rubber: 20 parts by weight;

[0035] Hexamethylenetetramine: 0.15 parts by weight;

[0036] Aminopropyltriethoxysilane: 3.5 parts by weight;

[0037] 400 mesh silica: 30 parts by weight;

[0038] Fumed silica: 2.0 parts by weight.

[0039] The bisphenol A type epoxy resin, methyltetrahydrophthalic anhydride, polysulfide rubber, aminopropyltriethoxysilane, 400 mesh silica and fumed silica are all industrial products, and the bisphenol A type The epoxy resin is 0.51mol / 100g, the particle size of the fumed silica is 0.2um, and the hexamethylenetetramine is of analytically pure grade.

[0040] The above raw materials are prepared according to the following steps for high temperature curing adhesive:

[0041] 1) First, mix bisphenol-A epoxy resin, ...

Embodiment 2

[0046] In the present embodiment, the raw material composition of adhesive is as follows:

[0047] Bisphenol A epoxy resin: 100 parts by weight;

[0048] Methyltetrahydrophthalic anhydride: 85 parts by weight;

[0049] Polysulfide rubber: 30 parts by weight;

[0050] Hexamethylenetetramine: 0.12 parts by weight;

[0051] Aminopropyltriethoxysilane: 4.0 parts by weight;

[0052] 400 mesh silica: 40 parts by weight;

[0053] Fumed silica: 1.5 parts by weight.

[0054] The bisphenol A type epoxy resin, methyltetrahydrophthalic anhydride, polysulfide rubber, aminopropyltriethoxysilane, 400 mesh silica and fumed silica are all industrial products, and the bisphenol A type The epoxy resin is 0.5mol / 100g, the particle size of the fumed silica is 0.3um, and the hexamethylenetetramine is of analytical grade.

[0055] The above raw materials are prepared according to the following steps for high temperature curing adhesive:

[0056] 1) First, mix bisphenol A epoxy resin, methylte...

Embodiment 3

[0061] In the present embodiment, the raw material composition of adhesive is as follows:

[0062] Bisphenol A epoxy resin: 100 parts by weight;

[0063] Methyltetrahydrophthalic anhydride: 90 parts by weight;

[0064] Polysulfide rubber: 35 parts by weight;

[0065] Hexamethylenetetramine: 0.10 parts by weight;

[0066] Aminopropyltriethoxysilane: 5.0 parts by weight;

[0067] 400 mesh silica: 50 parts by weight;

[0068] Fumed silica: 1.0 parts by weight;

[0069] The bisphenol A type epoxy resin, methyltetrahydrophthalic anhydride, polysulfide rubber, aminopropyltriethoxysilane, 400 mesh silica and fumed silica are all industrial products, and the bisphenol A type The epoxy resin is 0.5mol / 100g, the particle size of the fumed silica is 0.25um, and the hexamethylenetetramine is of analytically pure grade.

[0070] The above raw materials are prepared according to the following steps for high temperature curing adhesive:

[0071] 1) First, mix bisphenol-A epoxy resin, ...

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Abstract

The invention discloses a high-temperature curing adhesive for bonding electric insulators and a preparation method thereof. The curing adhesive comprises the following material components in parts by weight: 100 parts of bisphenol-A epoxy resin, 80 to 95 parts of methyl tetrahydrophthalic anhydride, 20 to 40 parts of polysulfide rubber, 0.10 to 0.30 part of hexamethylene tetramine, 3.5 to 5.0 parts of 3-aminopropyltriethoxysilanes, 20 to 60 parts of 400-mesh silica and 1.0 to 3.0 parts of fumed silica. By modifying the specific formula of the adhesive, the invention can prevent the electric insulators from sagging during the curing process and keep up the shape of the electric insulators after the adhesive is coated; and meanwhile, the bonding strength of the electric insulator interface is subject to the design requirements for the bonding strength of interfaces in insulator products.

Description

technical field [0001] The invention belongs to the production field of electrical porcelain sleeves, and relates to an adhesive used for bonding electrical porcelain sleeves, in particular to a high-temperature curing adhesive used for bonding electrical porcelain sleeves and a preparation method thereof. Background technique [0002] In the production process of traditional large-sized electrical porcelain bushings (generally greater than 2.5m in height), in order to reduce the difficulty of production and improve the pass rate, the green body will be dried, fired, cut and ground in sections, and then The pieces of porcelain are then bonded together to complete the production of the porcelain pieces. Therefore, various porcelain enterprises have developed the adhesive formula and bonding process for bonding porcelain pieces accordingly. The quality of the porcelain sleeves bonded by each unit varies according to the use occasions of various products and the different requ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/02C09J11/06C09J11/04C09J11/08
Inventor 朱斌焦芳王小宁
Owner CHINA XD ELECTRIC CO LTD
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