Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Percolation efficiency of the conductivity of electrically conductive adhesives

A technology of conductive adhesive and conductive filler, applied in the field of conductive adhesive, can solve problems such as increased contact resistance and high viscosity of conductive adhesive

Inactive Publication Date: 2009-12-16
THE HONG KONG UNIV OF SCI & TECH
View PDF0 Cites 9 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this method may lead to an increase in contact resistance (due to the increase in contact points) and excessive viscosity of the conductive adhesive

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Percolation efficiency of the conductivity of electrically conductive adhesives
  • Percolation efficiency of the conductivity of electrically conductive adhesives
  • Percolation efficiency of the conductivity of electrically conductive adhesives

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] Example 1-Surface modification of conductive filler

[0045] 10 grams of micron-sized silver flakes (about 5.6 microns in diameter) were dispersed in 100 ml of ethanol solution (containing 0.02% by weight of iodine). The solution was slowly stirred and mixed for 30 minutes at room temperature. The solution was then filtered through filter paper, and the filter cake was washed 3 times with ethanol. The filter cake was vacuum dried at room temperature until it was completely dry.

[0046] Preparation of modified conductive adhesive: The following data is based on a silver-containing adhesive formulation with a silver content of 75% by weight. In fact, the content of conductive filler can be within a wide range by adjusting the ratio of filler weight and resin matrix.

[0047] Mix 8.2 grams of dry silver flakes with 1.5 grams of bisphenol A epoxy resin (EPON 828) and 1.3 grams of methyl tetrahydrophthalic anhydride (MTHPA) for 30 minutes under high-speed stirring (the stirri...

Embodiment 2

[0049] Example 2-Sodium chlorite surface modifier

[0050] The modified conductive adhesive was prepared using the same steps as in Example 1, but the surface modifier was sodium chlorite instead of iodine. 10 grams of micron-sized silver flakes (about 5.6 microns in diameter) were dispersed in 100 ml of ethanol solution (containing 0.02% by weight of sodium chlorite). The solution was slowly stirred at room temperature for 30 minutes. The solution was filtered through filter paper and the filter cake was washed 3 times with ethanol. After that, the filter cake was vacuum dried at room temperature until it was completely dry.

Embodiment 3

[0051] Example 3-Bromine surface modifier

[0052] The modified conductive adhesive was prepared using the same steps as in Example 1, but the modifier was bromine instead of iodine. 10 grams of micron-sized silver flakes (about 5.6 microns in diameter) were dispersed in 100 ml of ethanol solution (containing 0.025% by weight of bromine). The solution was slowly stirred at room temperature for 30 minutes. The solution was filtered through filter paper and the filter cake was washed 3 times with ethanol. After that, the filter cake was vacuum dried at room temperature until it was completely dry.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Thermal expansion coefficientaaaaaaaaaa
Thicknessaaaaaaaaaa
Volume resistivityaaaaaaaaaa
Login to View More

Abstract

The present invention relates to percolation Efficiency of the conductivity of electrically conductive adhesives. The present invention further relates to an electroconductive bonding material consists of a resin matrix and a modified conductive filler. The resin matrix if formed by providing a thermosetting or thermoplastic resin-based polymer resin. The conductive filler is a metal filler material suitable for use as conductive filler for the resin matrix. The metal filler is modified by applying a material selected from one of halogens, pseudohalogens or their precursors.

Description

[0001] Related patent applications [0002] This patent application claims priority of US Provisional Patent Application No. 61 / 071,922 filed on May 27, 2008, which was filed by the inventor and incorporated herein by reference. Technical field [0003] The invention relates to a modified conductive adhesive (MECA) formed by mixing a surface-modified conductive filler and a resin matrix. By modifying the surface of the conductive filler, a thin layer of nanostructures containing partially oxidized metal halide or metal pseudohalide (pseudohalide) can be formed on the surface of the filler, which can improve the performance of the conductive filler after the MECA is cured. Conductivity. Background technique [0004] Over the years, due to the unique mechanical properties, processing characteristics, thermal properties, reliability and environmental friendliness of lead-free conductive adhesives, lead-free conductive adhesives have gradually replaced the widely used surface mount te...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C09J201/00C09J9/02C09J11/04C09J179/08C09J163/00C09J183/04C09J179/04C09C1/62C09C3/06C09C3/08
CPCH01B1/22H05K2203/125H05K3/321Y10T428/2991Y10T428/2998
Inventor 杨诚袁铭辉徐兵
Owner THE HONG KONG UNIV OF SCI & TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com