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Halogen-free ethoxyline resin antiflaming bonding adhesive and adhesive film thereof

A technology of flame retardant adhesives and halogenated epoxy resins, which is applied in the direction of epoxy resin adhesives, adhesives, adhesive types, etc., can solve the problems of environmental protection, poor heat resistance of cured products, general adhesion, etc., and achieve good Effects of heat resistance, good flame retardant durability, and superior adhesive performance

Active Publication Date: 2012-09-26
靖江亚星进出口有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The above-mentioned flame retardant adhesive is based on epoxy resin, among which brominated bisphenol A epoxy resin can achieve flame retardant effect, but because it contains halogen, it has an impact on environmental protection, and the adhesiveness of the composition is general; in addition, although the The nitrile rubber modified epoxy resin contained in the composition can act as a toughening agent, but the cured product of the film has poor heat resistance

Method used

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  • Halogen-free ethoxyline resin antiflaming bonding adhesive and adhesive film thereof
  • Halogen-free ethoxyline resin antiflaming bonding adhesive and adhesive film thereof

Examples

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preparation example Construction

[0020] The preparation process of the halogen-free epoxy resin flame retardant adhesive of the present invention is as follows:

[0021] (1) Dissolve nitrile rubber in a solvent, then mix various epoxy resins in proportion, add them, and stir at 40-60°C to form a solution;

[0022] (2) Warm up the solution in step (1) to 70-80°C, stir for 2-4 hours, then cool down to 45°C, and add curing agent and curing accelerator.

[0023] According to the methods of steps (1) and (2), the halogen-free epoxy resin flame-retardant adhesive can be prepared.

[0024] A halogen-free heat-resistant adhesive film comprising a release paper and a flame retardant adhesive coated on the release paper, wherein the flame retardant adhesive is the flame retardant adhesive described in the present invention.

[0025] The binder for forming a halogen-free heat-resistant adhesive film includes 100 parts by weight of epoxy resin, 35-50 parts by weight of nitrile rubber, 8-15 parts by weight of curing agen...

Embodiment 1

[0036] 35 parts of carboxyl-terminated nitrile rubber (product model 1072c, produced by Zeon Corporation, Japan, with acrylonitrile content of 27%wt, and carboxyl content of 3.4%wt), hydrogenated nitrile rubber (product model: 2020, produced by Japan Zeon Corporation, carboxyl content 3.5wt%) 10 parts are mixed and dissolved in 180 parts of methyl ethyl ketone solvent; 320) 50 parts, bisphenol A epoxy resin (model E51, produced by Wuxi Resin Factory, epoxy equivalent 275) 20 parts, novolac epoxy resin (product model D.E.N438, produced by Dow Chemical Company, epoxy equivalent 180, ring Oxygen functionality 3.6) 30 parts were mixed and added to the above mixture, stirred at 40°C for 2 hours to make a solution; the temperature of the above solution was raised to 70°C, stirred for 3 hours and then cooled to 45°C, and 10 parts of curing agent DDM and 0.8 part of curing accelerator hexafluoroantimonic acid (4-cyanobenzyl) amine salt was prepared into epoxy resin flame retardant adh...

Embodiment 2

[0039] With 35 parts of carboxyl-terminated nitrile rubber (commodity model 1072c, produced by Zeon Corporation of Japan, acrylonitrile content 27wt%, carboxyl content 3.4wt%), hydrogenated nitrile rubber (commodity model: 2020, produced by Japan Zeon Corporation, carboxyl content 3.5wt%) 8 parts are dissolved in the butanone solvent of 170 parts after mixing; ) 60 parts, bisphenol A epoxy resin (model E51, produced by Wuxi Resin Factory, epoxy equivalent 275) 15 parts, novolac epoxy resin (product model D.E.N438, produced by Dow Chemical Company, epoxy equivalent 180, epoxy Functionality 3.6) 25 parts were mixed and added to the above mixture, stirred at 50°C for 1.5 hours to make a solution; the above solution was heated to 75°C, stirred for 2 hours and then cooled to 45°C, and 8 parts of curing agent DDE was added and cured Accelerator 1.2 parts of hexafluoroantimonic acid (4-cyanobenzyl) amine salt, prepared as clear solution A2 of epoxy resin flame retardant adhesive with...

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Abstract

The invention provides a halogen-free ethoxyline resin antiflaming bonding adhesive comprising the following components according to the parts by weight: 100 ethoxyline resin, 35-50 nitrile rubber containing carboxyl, 8-15 curing agent and 0.5-2.0 curing accelerating agent. The halogen-free ethoxyline resin antiflaming bonding adhesive has excellent adhesive property, heat resistance and stable normal temperature storage and is suitable for bonding agents for the encapsulation of electric circuits.

Description

technical field [0001] The invention relates to an epoxy resin flame-retardant adhesive and its adhesive film for electronic circuit assembly, in particular to a halogen-free heat-resistant epoxy resin flame-retardant adhesive and its adhesive film. Background technique [0002] Epoxy resin packaging materials currently used in electronic circuits, such as packaging materials such as semiconductors and circuit boards, and adhesives in electronic materials all require flame-retardant properties. For their excellent flame retardancy, bromine-containing epoxy resins or similar flame retardant substances are usually included. However, such halogen-containing bromine compounds will produce corrosive gas fumes containing hydrogen bromide when burned; in addition, brominated epoxy resins may also produce toxic brominated dioxins (dioxin) furans when burned Substances are not conducive to the requirements of environmental protection. In view of this, the demand for halogen-free fl...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/00C09J9/00C09J11/06C09J109/02
Inventor 杨志祥张文娟
Owner 靖江亚星进出口有限公司
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