Method for preparing high phase ratio electric leakage resistant tracking index leadless compatible CEM-3 copper-clad laminate

Abstract

The invention discloses a method for preparing a high phase ratio electric leakage resistant tracking index leadless compatible composite base copper-clad laminate CEM-3, which comprises the following process steps: using low brominated epoxy resin / phenolic aldehyde as a main curing agent, adding a filling material to prepare core material glue impregnated glass fiber paper, and preparing a core material by making the glass fiber paper in a semi-solidified state at a temperature of between 130 and 210 DEG C; adding aluminum hydroxide or magnesium hydroxide as the filling material into the epoxy resin / phenolic aldehyde to prepare a plus material glue impregnated glass fiber cloth, and preparing the plus material by making the glass fiber cloth in a semi-solidified state at a temperature of between 130 and 210 DEG C; and superposing 1 to 20 sheets of the core material, pasting the plus material on the surface of the core material, cladding a copper foil on the plus material, and performing hot press molding at a temperature of between 80 and 200 DEG C, a pressure of between 10 and 60 Kg / cm and a vacuum degree of -60 mmHg. The CEM-3 copper-clad laminate prepared by the method simultaneously has CT1 more than or equal to 600V, higher heat resistance and excellent CAF resistance, and overcomes the defects that a CEM-3 plate prepared by the prior art has the CT1 between 175 and 249 V and poor heat resistance and CAF resistance, thus the CEM-3 copper-clad laminate is more adaptive to long-term operations under wet conditions and has high heat resistance and electric reliability.

Description

technical field [0001] The invention relates to a preparation method of a copper-clad laminate CEM-3, specifically a preparation method of a lead-free and compatible composite-based copper-clad laminate CEM-3 with a high relative tracking resistance index, and the product prepared by the invention belongs to electronic materials It is a composite base material of copper-clad laminates for printed circuit boards (PCBs), and belongs to the field of electronic technology. Background technique [0002] As people's requirements for the environmental performance of electronic products are increasing day by day, developed countries such as the United States, the European Union, and Japan have successively issued corresponding regulations. In 2003, the European Union issued the Directive on Waste Electrical and Electronic Equipment (WEEE) and the Directive on the Restriction of the Use of Certain Hazardous Substances in Electronic Products (ROHS). These two directives have been imp...

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Problems solved by technology

[0003] At present, ordinary CEM-3 board adopts epoxy / dicyandiamide curing system, which has high peel strength, good insulation performance, excellent processability and low cost, but has poor CAF resistance and low heat resistance. It is easy to produce resin greasy dirt when drilling holes, and the thermal expansion coefficient in the Z-axis direction is large. The above-mentioned curing system, the thermal decomposition temperature (Td) of the board is generally below 310°C, T260 is within 15min, and T288 is 0min. In the PCB lead-free process Therefore, improving the heat resistance and CAF resistance of CEM-3 and improving the tracking index have become the key directions of research and development in the field of electronic technology.

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