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Bi-component silicone pouring sealant for LED photoelectric display device and method for manufacturing same

A photoelectric display and two-component technology, applied in semiconductor/solid-state device manufacturing, chemical instruments and methods, electrical components, etc., can solve problems such as stickiness, uncured surface of glue, catalyst poisoning, etc., to avoid damage, effective Good for potting and simplifying the process

Active Publication Date: 2012-07-11
CHENGDU GUIBAO SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Chinese patent CN101016446 discloses a silicone electronic potting material suitable for LED and other electronic products. The patent is an addition-type silicone rubber. The platinum complex catalyst used is easy to be poisoned by the catalyst, so that the rubber is not cured or the surface is sticky. , needs high temperature curing at 150°C

Method used

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  • Bi-component silicone pouring sealant for LED photoelectric display device and method for manufacturing same
  • Bi-component silicone pouring sealant for LED photoelectric display device and method for manufacturing same
  • Bi-component silicone pouring sealant for LED photoelectric display device and method for manufacturing same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0046] Put 100 parts of α, ω-dihydroxypolydimethylsiloxane and 5 parts of dimethyldimethoxysilane into the vacuum kneader, stir evenly, add 50 parts of precipitated white carbon black, knead at room temperature for 2 hours, Then kneading and blending at a temperature of 100° C. and a vacuum of 0.06 Mpa for 30 minutes to obtain a silicone-based rubber.

[0047]100 parts of α, ω-dihydroxy polydimethylsiloxane, 35 parts of silicone-based glue, 5 parts of α, ω-dimethyl polydimethylsiloxane, poly Add 5 parts of dimethylsiloxane into a mixer, and stir for 30 minutes under a vacuum of 0.06mpa to obtain component A. 8 parts of mixture of tetraethoxysilane and tetraethoxysilane hydrolyzate, 0.3 parts of mixture of γ-aminopropyltriethoxysilane and γ-(2,3-glycidoxy)propyltrimethoxysilane Parts, 0.5 part of diisopropoxytitanium bis(ethyl acetoacetate) chelate, 0.2 part of diethylhydroxylamine, 0.01 part of dibutyltin dilaurate catalyst, α, ω-dimethylpolydimethyl Add 2 parts of siloxane ...

Embodiment 2

[0049] Put 100 parts of α, ω-dihydroxy polydimethylsiloxane and 15 parts of hexamethyldisilazane into the vacuum kneader, after mixing thoroughly, add 150 parts of precipitated white carbon black, knead at room temperature for 4 hours, and then Kneading and blending for 200 minutes at a temperature of 150°C and a vacuum of 0.099Mpa to obtain a silicone-based rubber;

[0050] 100 parts of α, ω-dihydroxy polydimethylsiloxane, 20 parts of silicone-based glue, 40 parts of silicon powder, 10 parts of calcium carbonate, 10 parts of α, ω-dimethyl polydimethylsiloxane , 10 parts of polydimethylsiloxane with a hydroxyl group at one end and a methyl group at the other end were added to a blender, added to the blender, and stirred for 30 minutes under a vacuum degree of 0.08mpa to obtain component A. Mixture of tetraethoxysilane and tetraethoxysilane hydrolyzate 5 parts, mixture of γ-aminopropyltriethoxysilane and γ-(2,3-glycidoxy)propyltrimethoxysilane 1 Parts, 0.3 parts of diisopropox...

Embodiment 3

[0052] Put 100 parts of α, ω-dihydroxy polydimethylsiloxane and 10 parts of tetramethylammonium siloxanol and dimethyldiethoxysilane into the vacuum kneader, after mixing thoroughly, add 100 parts Precipitate white carbon black, knead at room temperature for 3 hours, then knead and blend at a temperature of 120° C. and a vacuum of 0.08 Mpa for 30 to 200 minutes to obtain a silicone-based rubber.

[0053] 100 parts of α, ω-dihydroxy polydimethylsiloxane, 10 parts of silicone-based glue, 30 parts of aluminum oxide, 15 parts of α, ω-dimethyl polydimethylsiloxane, one end is Add 15 parts of polydimethylsiloxane with a methyl group at one end of the hydroxyl group into the mixer, add it into the mixer, and stir for 30 minutes under a vacuum degree of 0.099mpa to obtain component A. 10 parts of a mixture of tetraethoxysilane and tetraethoxysilane hydrolyzate, a mixture of γ-aminopropyltriethoxysilane and γ-(2,3-glycidoxy)propyltrimethoxysilane 3 Parts, 0.1 part of diisopropoxytitan...

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Abstract

The invention relates to a bi-component silicone pouring sealant for an LED optoelectronic display device and a method for manufacturing the same. The bi-component silicone pouring sealant is characterized in that the sealant is obtained through the reaction of components A and B by using alpha,omega-dihydroxy polydimethylsiloxane of which the structural formula shown on the right as a main material. The component A is prepared from the following components by weight portion through mixing: 100 portions of the alpha,omega-dihydroxy polydimethylsiloxane, 10 to 35 portions of organosilicon based gel, 0 to 50 portions of stuffing, and 10 to 30 portions of plasticizer; and the component B is prepared from the following components in portion by weight through mixing: 5 to 10 portions of cross-linking agent, 0.3 to 3 portions of coupling agent, 0.1 to 0.5 portion of titanate complex, 0.1 to 0.5 portion of diethyl hydroxylamine, 0.01 to 0.1 portion of dibutyltin dilaurate catalyst, and 2 to 10 portions of plasticizer. The silicone pouring sealant prepared by the method has the advantages of simple process flow, good adhesive property, excellent temperature and weather resistant properties, and good flow property, and can be widely applicable for embedding electronic devices such as the LED optoelectronic display device and the like.

Description

technical field [0001] The invention relates to a two-component room temperature vulcanized silicone potting glue for LED photoelectric display devices and a manufacturing method thereof, belonging to the field of polymer potting materials. Background technique [0002] Potting is the operation process of reasonably arranging, assembling, bonding, connecting and isolating and protecting the various parts of the electronic components according to the requirements. Its function is to strengthen the integrity of electronic devices, improve the resistance to external shocks and vibrations; improve the insulation between internal components and circuits; it is conducive to the miniaturization and weight reduction of devices, and the direct exposure of circuits to the environment, improving the waterproofing of devices , Moisture-proof performance. [0003] LED (Semiconductor Light Emitting Diode) is a new type of light source with obvious energy saving, environmental protection ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J183/06C09K3/10H01L21/56
Inventor 熊婷邱泽皓袁素兰王有治
Owner CHENGDU GUIBAO SCI & TECH
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