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Photosensitive resin composition, and flexible print circuit board using the same

A technology of photosensitive resin and composition, which is applied in the direction of printed circuit, printed circuit manufacturing, printed circuit secondary treatment, etc., can solve the problem of embedding, adhesion, photosensitivity, developability and flame retardancy etc.

Active Publication Date: 2009-09-16
HEFEI HANZHIHE MATERIAL SCI & TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Such a simple combination of these conventionally known technologies makes it difficult to suppress warpage when forming a dry film while achieving embedding properties in the wiring pattern substrate, adhesion to the wiring pattern substrate, photosensitivity, developability, and flame retardancy. sex

Method used

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  • Photosensitive resin composition, and flexible print circuit board using the same
  • Photosensitive resin composition, and flexible print circuit board using the same
  • Photosensitive resin composition, and flexible print circuit board using the same

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0246] A bulb condenser with a moisture meter was installed on a 1 liter 3-necked separable flask with a stirrer. Add 268.52 g of γ-butyrolactone (manufactured by Wako Pure Chemical Industries, Ltd.), 31.02 g (100 mmol) of oxydiphthalic anhydride (manufactured by MANAC Corporation), 68.55 g (75 mmol) of 1,3- Bis(3-aminopropyl)polysiloxane (molecular weight: 914, manufactured by Shin-Etsu Chemical Co., Ltd.), and 7.61 g (50 mmol) of 3,5-diaminobenzoic acid (manufactured by Aldrich) were stirred at room temperature for 2 hours.

[0247] Add 1.5g (15 mmol) of γ-valerolactone, 2.4 g (30 mmol) of pyridine and 50 g of toluene into the above-mentioned flask, raise the temperature to 180° C., and remove the azeotropic component of toluene-water at 180 rpm Stirring at high speed for 2 hours. After standing to cool at room temperature, 20.62 g (50 mmol) of 1,2-(ethylene) bis(trimellitate anhydride) (manufactured by Nippon Chemical Co., Ltd.), 7.31 g (25 mmol) of 1,3 - Bis(4-aminopheno...

Synthetic example 2

[0286] A bulb condenser with a moisture meter was installed on a 1 liter 3-necked separable flask with a stirrer. Add 341.64 g of γ-butyrolactone (manufactured by Wako Pure Chemical Industries, Ltd.), 31.02 g (100 mmol) of oxydiphthalic anhydride (manufactured by MANAC Corporation), 68.55 g (75 mmol) of 1,3- Bis(3-aminopropyl) polysiloxane (molecular weight 914, manufactured by Shin-Etsu Chemical Industry Co., Ltd.), 14.31 g (50 mmol) of 3,3'-dicarboxy-4,4'-diaminodiphenylmethane ( Wakayama Seika Co., Ltd.), and stirred at room temperature for 2 hours.

Embodiment 12

[0288] In Example 12, it evaluated similarly to Example 5 except having changed the varnish containing (A) component of Example 5 into the varnish containing (A) component described in polyimide synthesis example 2. The results were as follows: warpage ◎, flame retardancy ○, laminarity ○, photosensitivity ○.

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Abstract

Disclosed is a photosensitive resin composition comprising components (A), (B) and (C), wherein the component (A) is an alkali-soluble resin, the component (B) is at least one compound selected from the group consisting of a compound having a structure represented by the formula (1), a compound having an isocyanurate ring and an imide compound having one or two imide groups which is different from the compound of the component (A), and the component (C) is a quinonediazide compound. P=X (1) wherein P represents a phosphorus atom, wherein the number of covalent bonds is 5; X represents a nitrogen atom or an oxygen atom, wherein the number of covalent bonds is 3 when X represents a nitrogen atom, the number of covalent bonds is 2 when X represents an oxygen atom, and the phosphorus atom andthe nitrogen or oxygen atom are bound to each other via a double bond.

Description

technical field [0001] The present invention relates to a photosensitive resin composition suitable for use in a cover layer of a flexible printed wiring board, and a flexible printed wiring board using the composition. Background technique [0002] In the field of flexible printed circuit boards (hereinafter abbreviated as FPC), which are developing rapidly in recent years, materials with excellent flexibility and flexibility are required as base materials and cover layers. From the aspect of the superiority of the process, it is preferable to make the cover layer of the FPC into a dry film that can be laminated. [0003] Also, it is desirable that the dry film has photosensitivity. Among them, when performing fine processing on a general polyimide material, the etching process is performed using a photoresist, so the number of steps required is large. Therefore, the photosensitive polyimide material that can directly form a pattern on the polyimide itself as an insulatin...

Claims

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Application Information

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IPC IPC(8): G03F7/023G03F7/004H05K3/28
CPCG03F7/0226H05K3/287G03F7/027
Inventor 清水建树长泽俊明高桥秀明梭温茂五岛敏之
Owner HEFEI HANZHIHE MATERIAL SCI & TECH CO LTD
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