Organosilicon lubricating grease composition with heat conductivity

A technology of silicon grease and thermal conductivity, which is applied in the field of thermal conductive silicone grease composition, can solve the problems of uncurable, insufficient, and poor distribution, and achieve improved reliability, high discharge performance, and high thermal conductivity rate effect

Inactive Publication Date: 2009-09-09
SHIN ETSU CHEM IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the case of using a heat releasing sheet, since the minute unevenness cannot be completely buried, as a result, air with a strong heat insulating effect is trapped together, and sufficient heat dissipation cannot be obtained in an IC package that generates a large amount of heat. Exothermic effect
In addition, sometimes an adhesive layer is provided on the surface of the heat radiation sheet to prevent air from entering, but this is not sufficient for the same reason when it is used in an IC module that generates a large amount of heat.
[0003] In order to completely exclude the air, liquid exothermic grease is being turned

Method used

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  • Organosilicon lubricating grease composition with heat conductivity
  • Organosilicon lubricating grease composition with heat conductivity
  • Organosilicon lubricating grease composition with heat conductivity

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～9、 comparative example 1～9

[0118] First, the following components to form the composition of the present invention are prepared.

[0119] ingredient (A)

[0120] A-1: Both ends are capped with dimethylvinylsilyl groups, and the kinematic viscosity at 25°C is 600mm 2 / s of dimethyl polysiloxane.

[0121] Component (B) is an organohydrogenpolysiloxane represented by the following formula

[0122] B-1:

[0123] 【chemical 10】

[0124]

[0125] B-2:

[0126] 【chemical 11】

[0127]

[0128] B-3 (for comparison):

[0129] 【Chemical 12】

[0130]

[0131] B-4 (for comparison):

[0132] 【chemical 13】

[0133]

[0134] Component (C) organohydrogenpolysiloxane represented by the following formula

[0135] C-1:

[0136] 【Chemical 14】

[0137]

[0138] C-2:

[0139] 【chemical 15】

[0140]

[0141] ingredient (D)

[0142] The following aluminum powder, aluminum oxide powder and zinc oxide powder were mixed at room temperature using a 5-liter frame mixer (manufactured by Inoue Manufactu...

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Abstract

The invention provides a liquid organosilicon lubricating grease composition, which is cast between a heating element and a heat radiation element and then solidified, thereby improving thermometric conductivity and simultaneously maintaining allocation performance of organosilicon lubricating grease composition with heat conductivity. The organosilicon lubricating grease composition with heat conductivity contains the following substances: 25 DEG C, viscosity 50-1000 Pa.s: (A) organopolysiloxane containing more than two alkenyl groups in one molecule; (B) organic hydrogen polysiloxane showed in general formula (1); (C) organic hydrogen polysiloxane showed in general formula (2); (D) bulking agent with heat conductivity, whose thermometric conductivity is more than 10W/m DEG C; (E) catalyst selected from platinum and platinum compound; (F) control agent selected from acetylenic compound, nitrogen compound, organic phosphorus compound, oxime compound and organic chloride compound; (G) volatile solvent for dispersing or dissolving ingredients mentioned above and the boiling point is 80-360 DEG C.

Description

technical field [0001] The present invention relates to thermally conductive silicone grease compositions containing volatile solvents. Background technique [0002] Currently, not only in the semiconductor industry, but also in various fields such as the automobile industry and home appliance manufacturing, semiconductor devices are beginning to be introduced. The structure of a semiconductor device that has become mainstream at present is composed of an IC package and a heat radiator for dissipating heat from the surface of the IC package. In the meantime, the thermally conductive silicone composition is cast and thermally cured under pressure to bury the microscopic unevenness on the surface of the IC package or the surface of the heat sink while connecting heat generation. body and exothermic body (Japanese Patent Application Laid-Open No. 2002-327116: Patent Document 1). At this time, a heat release sheet or heat release grease can also be used. However, in the case ...

Claims

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Application Information

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IPC IPC(8): C08L83/04
CPCB01J23/42C10M107/50
Inventor 松本展明矶部宪一三好敬樱井郁男山田邦弘
Owner SHIN ETSU CHEM IND CO LTD
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