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A method of promoting crack healing in gel-cast biscuits

A technology of pouring molding and gelling, applied in the direction of ceramic molding machines, manufacturing tools, etc., to achieve the effects of easy realization, uniform and complete structure, and improved quality and yield

Active Publication Date: 2011-12-14
江苏先进无机材料研究院
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

And about the scheme of healing the cracks in the gel-cast biscuit by controlling the curing and drying process, there is no report at home and abroad at present

Method used

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  • A method of promoting crack healing in gel-cast biscuits
  • A method of promoting crack healing in gel-cast biscuits

Examples

Experimental program
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Effect test

Embodiment 1

[0014] The monomer acrylamide was dissolved in deionized water to make a 15wt% solution, and the cross-linking agent N,N'-methylenebisacrylamide (MBAM) was added. The ratio of crosslinking agent to monomer is 1:6. The dispersant tetramethylammonium hydroxide (TMAH) was then added to prepare a premix. Add silicon carbide powder and ball mill to obtain a slurry with a solid content of about 50vol%, and the viscosity of the slurry is about 300-600mPa.s. Add the initiator azo[2-(2-imidazolin-2-yl)]propane hydrochloride (AZIP·2HCl)), wherein the addition amount of the initiator is 1 / 10-1 / 15 of the monomer. Stir vigorously and defoam after addition. Then pour into molds as needed. Curing in the temperature range of 40-60 ℃ for 30-60min. Take it out and get a wet biscuit after demoulding. Then put the wet biscuit in a constant temperature and humidity oven, and dry it for 24-96 hours at 50-75°C and a relative humidity of 80-95%, and finally use a multi-step drying method to obta...

Embodiment 2

[0016]The monomer methacrylamide was dissolved in deionized water to make a 15wt% solution, and the cross-linking agent N,N'-methylenebisacrylamide (MBAM) was added. The ratio of crosslinking agent to monomer is 1:3. A dispersant polyethyleneimine (PEI) was then added to prepare a premix. Add titanium carbide powder and ball mill to obtain a slurry with a solid content of about 50vol%, and the viscosity of the slurry is about 300-600mPa.s. Ammonium persulfate (APS) is added as an initiator, wherein the amount of the initiator added is 1 / 10-1 / 15 of the monomer. Stir vigorously and defoam after addition. Then pour into molds as needed. Curing in the temperature range of 40-50 ℃ for 20-60min. Take it out and get a wet biscuit after demoulding. Then put the wet biscuit in a constant temperature and constant humidity oven, and dry it for 24-96 hours at 50-70°C and a relative humidity of 80-95%, and finally obtain a defect-free gel-cast bisque by a multi-step drying method.

Embodiment 3

[0018] The monomer N,N-dimethylacrylamide was dissolved in deionized water to make a 15wt% solution, and the cross-linking agent N,N'-methylenebisacrylamide (MBAM) was added. The ratio of crosslinking agent to monomer is 1:6. Then add the dispersant tetramethylammonium hydroxide to prepare the premix. Add boron carbide powder and ball mill to obtain a slurry with a solid content of about 57vol%, and the viscosity of the slurry is about 400-600mPa.s. Azo(2-mimidylpropane) hydrochloride (AZAP·2HCl) is added as an initiator, wherein the amount of the initiator added is 1 / 10-1 / 15 of the monomer. Stir vigorously and defoam after addition. Then pour into molds as needed. Curing in the temperature range of 40-60°C for 30-90min. Take it out and get a wet biscuit after demoulding. Then put the wet green body in a constant temperature and constant humidity oven, and dry it for 60-96 hours at 60-80° C. and a relative humidity of 85-95%, and finally adopt a multi-step drying method t...

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Abstract

Aiming at the defect that cracks are easy to appear in the gel-casting wet bisque, the present invention proposes an improved curing and drying scheme, which can effectively heal the microcracks of the wet bisque during demoulding, moving and due to the rapid volatilization of the surface solvent , to ensure a complete, defect-free green body after drying. The crack healing scheme proposed by the present invention is mainly divided into two steps of curing and drying. In the curing stage, the gelation process of the monomers in the slurry is controlled by adjusting the curing temperature and curing time to ensure that part of the monomers are cross-linked to form a gel after curing, and the other part of the monomers remains in the form of monomers. In the subsequent drying process, a constant temperature and constant humidity drying scheme is adopted, so that the remaining monomers in the green body can continue to solidify, and bridges are formed between the cracked surfaces, thereby promoting crack healing. The crack healing scheme proposed by the invention has a simple and reliable process and is suitable for the preparation of bulk or porous ceramics.

Description

technical field [0001] The present invention relates to a method of promoting the healing of cracks in gel cast biscuits. The invention belongs to the preparation technology and application field of ceramics. Background technique [0002] With the development of modern science and technology, the advanced preparation technology of high-performance ceramic components has become one of the focus and hot spots of research, especially the preparation technology of large-sized and complex-shaped products. Ceramic materials are not only prone to defects during the molding process, but also the formed defects are often difficult to make up and eliminate through subsequent processes. In addition, the high hardness and high wear resistance of ceramic materials make subsequent processing difficult and expensive. For products with complex shapes, the processing problem is particularly difficult. Therefore, molding technology, as a key link in the preparation process, directly affects...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B28B11/24C04B35/624
Inventor 张景贤江东亮林庆玲陈忠明黄政仁
Owner 江苏先进无机材料研究院
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