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Conductive particles, adhesive composition, circuit connection material and connection structure, as well as connection method of circuit member

A technology of circuit connection materials and conductive particles, which is applied in the direction of conductive adhesives, conductive materials dispersed in non-conductive inorganic materials, and printed circuits assembled with electrical components, which can solve the problem of increased resistance value of connected parts and the number of conductive particles. Insufficient, insufficient insulation between adjacent circuit electrodes, etc., to achieve the effect of suppressed resistance value, low initial resistance value, and excellent insulation

Inactive Publication Date: 2009-07-15
RESONAC CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the conventional adhesive composition has a problem that the number of conductive particles interposed between the circuit electrodes to be connected becomes insufficient, and the resistance value of the connected portion increases.
[0005] On the other hand, if the conductive particle content of the adhesive composition is increased to prevent such problems, the insulation between adjacent circuit electrodes may become insufficient.

Method used

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  • Conductive particles, adhesive composition, circuit connection material and connection structure, as well as connection method of circuit member
  • Conductive particles, adhesive composition, circuit connection material and connection structure, as well as connection method of circuit member
  • Conductive particles, adhesive composition, circuit connection material and connection structure, as well as connection method of circuit member

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0130] Conductive core particles were produced by the following method. That is, cross-linked polystyrene particles (manufactured by Soken Chemical Co., Ltd., trade name: SX series, average particle diameter: 4 μm) were prepared as substrate particles, and a Ni layer (thickness: 0.08 μm) was provided on the surface of the particles by electroless plating. ). Furthermore, an Au layer (thickness: 0.03 μm) was provided outside the Ni layer by electroless plating to obtain core particles having a conductive layer composed of a Ni layer and an Au layer.

[0131] As an organic polymer compound (insulating coating part) for covering the surface of the core particle, a cross-linked acrylic resin (manufactured by Soken Chemical, trade name: MP series, degree of cross-linking: 20%, gel fraction: 18%) was prepared. . 4 g of the cross-linked acrylic resin and 20 g of core particles were placed in a fine particle surface modification device (Hibrideyza—) (manufactured by Nara Machinery M...

Embodiment 2

[0148] Except that a cross-linked acrylic resin with a cross-linking degree of 10% (manufactured by Soken Chemical Co., Ltd., trade name: MP series, gel fraction: 8%) was used instead of a cross-linked acrylic resin with a cross-linking degree of 20%, the others were as in the examples. 1 Conductive particles, circuit connection materials and connection structures were fabricated. The coverage of the conductive particles was 25%.

Embodiment 3

[0150]Conductive particles, circuit connection materials, and connection structures were manufactured in accordance with Example 1, except that an insulating covering portion was formed on the surface of the core particles by the following method.

[0151] It is to put the same core particles and cross-linked acrylic resin (manufactured by Soken Chemical Co., Ltd., trade name: MP series, cross-linking degree: 10%, gel fraction: 8%) as those produced in Example 1 into the microparticle surface modification device, produced as image 3 Conductive particles of the structure shown. In addition, the processing conditions of the microparticle surface modifying device were a rotation speed of 16000 / min and a reaction tank temperature of 60°C. The coverage of the conductive particles was 30%.

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Abstract

A conductive particle comprising: a core particle having an electrical conductivity; and a insulating coating provided on the surface of the core particle and comprising an organic polymeric compound, wherein the conductive particle has a coverage ratio as defined by the formula (1) of 20 to 40%.

Description

technical field [0001] The present invention relates to conductive particles, an adhesive composition, a circuit connection material and a connection structure, and a method for connecting circuit components. Background technique [0002] As methods for mounting liquid crystal driver ICs on glass panels for liquid crystal displays, chip-on-glass mounting (hereinafter referred to as "COG mounting") and chip-on-flex mounting (hereinafter referred to as "COF mounting") are widely used. COG mounting is a method of directly bonding LCD driver ICs to glass panels. On the other hand, COF mounting is a method in which ICs for driving liquid crystals are bonded to a flexible tape with metal wiring, and then bonded to a glass panel. [0003] In the above-mentioned COG mounting and COF mounting, an adhesive composition having anisotropic conductivity is generally used as a circuit connection material. This adhesive composition is a composition in which conductive particles are disper...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B5/00C09J201/00C09J9/02H01B1/20C09J11/00H05K3/32
CPCH01L2224/29387H01L2224/29493H01L2924/0105H01L2924/01049H01L2924/01045H05K2201/0224H01L2924/01044H01L2224/29388H01L2924/0132H01L2224/29469H01L2924/19041H01L2924/01013H01L2224/29447H01L2924/0665H01L2224/2919H01L2224/2929H01L2924/19043H01L2224/29455H01L2224/838H01L2924/01076H01L24/83H01L2924/01033H01L2224/29439H01B3/004H01L2924/01078H05K3/323H01L2924/01015H01L2924/01023H01L2924/01046H01L2924/01082H01B1/22H01B1/24H01L2924/0781H01L2924/01004H01L2224/83101H01L2924/09701H01L2924/01029H01L2224/29111H01L2924/01027H01L2924/014H01L2224/29444H01L2924/01047H01L2924/01079H01L2224/29311H01L2924/14H01L24/29H01L2924/19042H01L2924/01005H01L2924/01006C09J9/02H01L2924/01077H01L2924/07802H01L2924/15788H01L2924/00H01L2924/01028H01L2924/00014H01B1/20H01B5/00H05K3/32
Inventor 田中胜竹田津润
Owner RESONAC CORPORATION
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