Thermoplastic polyimide, and laminated polyimide film and metal foil-laminated polyimide film using the thermoplastic polyimide

A technology of polyimide film and polyimide layer, which is applied in the field of thermoplastic polyimide, can solve the problems of warping and other problems, and achieve the effects of low glass transition temperature, not easy to deteriorate, and high elongation at break

Inactive Publication Date: 2009-07-15
TORAY IND INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in order to obtain a laminated polyimide film having heat-fusible polyimide on only one side, there is a problem of increased warping

Method used

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  • Thermoplastic polyimide, and laminated polyimide film and metal foil-laminated polyimide film using the thermoplastic polyimide
  • Thermoplastic polyimide, and laminated polyimide film and metal foil-laminated polyimide film using the thermoplastic polyimide
  • Thermoplastic polyimide, and laminated polyimide film and metal foil-laminated polyimide film using the thermoplastic polyimide

Examples

Experimental program
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Effect test

Embodiment

[0074] The following examples are given to illustrate the present invention, but the present invention is not limited by these examples. Evaluation methods for glass transition temperature, adhesive force, tensile modulus and elongation at break are as follows.

[0075] (1) Glass transition temperature

[0076] A polyimide film of about 5 mg was placed in an aluminum standard container, and the glass transition temperature was measured by the DSC method. The measuring device used a differential scanning calorimeter DSC-50 (manufactured by Shimadzu Corporation), heated to 350°C, cooled to 100°C, and then raised to 450°C at a rate of 20°C / min. The glass transition temperature was obtained from the inflection point of the curve.

[0077] (2) Adhesion

[0078] The metal foil of the metal foil laminated polyimide film was etched with a ferric chloride solution to form a 2 mm wide pattern. Using "Tensilon" UTM-4-100 (manufactured by TOYO BOLDWIN), the metal layer having a width ...

manufacture example 1

[0117] Add 2.70kg of PDA, 15.02kg of DAE, and 120kg of NMP into a reaction kettle equipped with a thermometer, a dry nitrogen inlet, a heating and cooling device using hot water and cold water, and a stirring device, and stir at 30°C to dissolve completely. Next, 29.72 kg sBPDA, 69.75 kg NMP were added at 30°C. Reaction was carried out at 60° C. for 4 hours to obtain 20% by weight of polyamic acid varnish 1 (PAA1). The glass transition temperature of the thermoplastic polyimide obtained by imidization is 253°C, and the thermal linear expansion coefficient at 30°C to 200°C is 34×10 -6 (1 / °C).

manufacture example 2

[0119] Add 2.70kg of PDA, 15.02kg of DAE, and 120kg of NMP into a reaction kettle equipped with a thermometer, a dry nitrogen inlet, a heating and cooling device using hot water and cold water, and a stirring device, and stir at 30°C to dissolve completely. Next, 29.13 kg sBPDA, 60 kg NMP were added at 30°C. After reacting at 60° C. for 4 hours, cool to 30° C., add 0.30 kg PA and 8.60 kg NMP, and react at 60° C. for another 2 hours to obtain 20% (by weight) polyamic acid varnish 2 (PAA2). The glass transition temperature of the thermoplastic polyimide obtained by imidization is 253°C, and the thermal linear expansion coefficient at 30°C to 200°C is 34×10 -6 (1 / °C).

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Abstract

Disclosed is a thermoplastic polyimide which has excellent heat resistance and can adhere to a metal foil by thermocompression bonding for a short-time. The thermoplastic polyimide comprising a tetracarboxylic dianhydride residue and a diamine residue wherein the biphenyl tetracarboxylic dianhydride residues account for 80 mol% or more of the total tetracarboxylic dianhydride residues, the 4,4'-diaminodiphenyl ether residues for 65 mol% or more and 85 mol% or less of the total diamine residues, and the paraphenylene diamine residues for 15 mol% or more and 35 mol% or less of the total diamine residues.

Description

technical field [0001] The present invention relates to a thermoplastic polyimide, a laminated polyimide film using the polyimide, a method for producing the same, and a metal foil-laminated polyimide film using the polyimide. Background technique [0002] Polyimide films are used in a wide range of industrial fields including electronic devices due to their excellent heat resistance and mechanical properties. Among them, a metal-foil-laminated polyimide film obtained by heat-press-bonding a polyimide film and a metal foil is preferably used as a material for a flexible substrate. As an adhesive when a polyimide film and a metal foil are heat-press-bonded, the adhesive using thermosetting resin, such as an epoxy-type adhesive, or thermoplastic polyimide is used normally. Metal-foil-laminated polyimide films using thermoplastic polyimide as an adhesive are used as high-performance metal-foil-laminated polyimide films because of their excellent heat resistance and flexibility...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10B32B15/088B32B27/34
Inventor 霞健一松村宣夫
Owner TORAY IND INC
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