Loop type heat pipe radiator and manufacturing method thereof

Abstract

The invention discloses a loop-type heat pipe radiator and a method for making the same. The radiator comprises a plate-type evaporation chamber, a porous capillary structure and outside pipelines. The porous capillary structure is filled into the plate-type evaporation chamber; the outside pipelines are connected with both ports of the plate-type evaporation chamber; the outside pipelines and the plate-type evaporation chamber form a closed loop; working fluid is filled in the plate-type evaporation chamber; and one end of the plate-type evaporation chamber is connected with a fluid charging pipe. The making method comprises the following steps of forming the plate-type evaporation chamber, configuring the capillary structure, pressing edges and welding, pouring fluid to make vacuum, sealing and electric welding. The radiator can effectively save space because of the thinner wall of the plate-type evaporation chamber, can save contact thermal resistance between heating elements and the plate-type evaporation chamber because the heating surface is a plane, can solve the problem that the density of heat flow of the heating elements increases gradually because of the high heat radiating power, can increase the heat transferring distance because of the longer outside pipelines, and meanwhile can achieve mass production because of simple structure and production process.

Description

technical field [0001] The invention relates to a cooling device and a manufacturing method thereof, in particular to a loop type heat pipe cooling device and a manufacturing method thereof. Background technique [0002] The heat source of electronic components mainly comes from the chip itself. As long as it is used with electricity, it will generate heat due to the resistance of the chip itself and the current flowing through it. With the continuous miniaturization of integrated circuit manufacturing process, more and more functions are integrated on a single chip. Compared with notebook computers, the main chip CPU is also packaged in the same CPU due to the increase in operating frequency and multiple core processors. In fact, although the computing speed and working time of the computer can be greatly improved, the heat generated by the CPU also rises sharply from low wattage to high wattage. At present, most of the heat dissipation methods of notebook computers are co...

AI Technical Summary

Problems solved by technology

Because the fan needs to provide additional auxiliary power and it will generate a certain amount of noise when it rotates, not only will the battery life of the laptop itself be shortened, but the noise generated by the fan itself will also interfere with the workplace, and due to the length and diameter of the heat pipe The difference in size and shape will affect its maximum heat transfer efficiency, often resulting in damage to the system due to insufficient heat transfer of the heat pipe in the effective space of the notebook computer

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