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Double side flexible copper coated board and manufacturing method thereof

A technology of flexible copper clad laminates and manufacturing methods, which is applied in the direction of circuit substrate materials, printed circuit manufacturing, and improvement of metal adhesion of insulating substrates, and can solve the problems of high cost, appearance, and double-sided flexure of two-layer flexible cover films. Solve the problems of difficult thinning of permanent copper clad laminates and poor dimensional stability, and achieve the effects of easy mass production, low cost, and good flame retardancy

Active Publication Date: 2009-04-29
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is to provide a double-sided flexible copper-clad laminate, which can overcome the shortcomings of the difficulty of thinning and poor dimensional stability in the manufacture of double-sided flexible copper-clad laminates by the three-layer method, and the flexible cover film of the two-layer method The problems of high cost and poor appearance, its excellent comprehensive performance, low cost, can realize the thinning of the substrate

Method used

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  • Double side flexible copper coated board and manufacturing method thereof
  • Double side flexible copper coated board and manufacturing method thereof
  • Double side flexible copper coated board and manufacturing method thereof

Examples

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preparation example Construction

[0027] 1. Preparation of raw materials

[0028] 1.1. Polyamic acid composition

[0029] The polyamic acid solution is obtained by dissolving tetraformic anhydride compounds and diamine compounds in DMAC or NMP solvent, the equivalent ratio of acid anhydride to amine is in the range of 0.9-1.0, and polymerizing at 4-35°C.

[0030] 1.2. Modified epoxy resin composition

[0031] 1.2.1 Halogen-modified epoxy resin composition

[0032] 10-40 parts by weight of low bromine epoxy resin;

[0033] 10-20 parts by weight of high bromine epoxy resin;

[0034] Carboxyl-terminated nitrile rubber 15-30 parts by weight;

[0035] 5-15 parts by weight of curing agent;

[0036] 0.05-1.5 parts by weight of curing accelerator;

[0037] 20-100 parts by weight of filler;

[0038] Solvent: appropriate amount;

[0039] Mix the above materials evenly to obtain a modified epoxy resin composition.

[0040] 1.2.2. Halogen-free modified epoxy resin composition

[0041] 30-60 parts by weight of ph...

Embodiment 1

[0069] Embodiment 1: Adhesive adopts modified epoxy resin composition

[0070] Low-bromine epoxy resin (product model 530, manufactured by DOW Chemical Co.) 39 parts by weight; synthetic rubber (product model Nipol 1072, acrylonitrile content 27% by mass, manufactured by Zeon Corporation) 20 parts by weight; diaminodiphenylsulfone 2.5 parts by weight 0.30 parts by weight of 1-cyanoethyl-2-ethyl-4-methylimidazole (2E4MZ-CN); 30 parts by weight of aluminum hydroxide (average particle diameter is 1 to 5 μm, purity more than 99%); antioxidant (Product model number 1010, manufactured by CIBA GEIGY Co.) 0.20 parts by weight. The solid content of the glue solution is adjusted to 40% with butanone solvent, and mixed to form a halogen-free epoxy resin composition. The composition is coated on the above-mentioned treated single-sided polyimide flexible copper-clad board by a glue coating machine, and the thickness of the coated glue layer is 13 μm, and then heated and dried in an oven ...

Embodiment 2

[0071] Example 2: The adhesive uses a halogen-free modified epoxy resin composition

[0072] Phosphorus-containing epoxy resin (product model XZ 92530, epoxy equivalent 340g / eq, phosphorus content 3.0 mass%, manufactured by Dow Chemical Company) 38 parts by weight; synthetic rubber (commodity model Nipol 1072, acrylonitrile content 27 mass%, Zeon Corporation manufacturing) 20 weight parts; Rubber-modified epoxy resin (commodity model Hy RK84, elastomer content 32 mass %, CVC Specialty Chemicals Inc., manufacture) 16 weight parts; Phosphorus-containing phenolic resin (commercial model XZ92741, phosphorus content 9 mass %, manufactured by Dow Chemical Company) 26 parts by weight; Diaminodiphenyl sulfone 2.0 parts by weight; 0.30 parts by weight of 1-cyanoethyl-2-ethyl-4-methylimidazole (2E4MZ-CN); Aluminum hydroxide ( 30 parts by weight of an average particle diameter of 1 to 5 μm, and a purity of 99% or more); 0.20 parts by weight of an antioxidant (product model 1010, manufact...

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Abstract

The invention relates to a double-sided flexible copper clad laminate and a production method thereof, the double-sided flexible copper clad laminate comprises a single-sided copper clad laminate, an adhesive layer which is coated on the single-sided copper clad laminate and the other copper foil or the other single-sided copper clad laminate which is coated on the adhesive layer by pressing, the single-sided copper clad laminate comprises one copper foil and a polyimide layer which is coated on the copper foil, wherein, the polyimide layer and the adhesive layer are adjacently arranged. The production method comprises the following steps: the copper foil is provided and polyamide acid and an adhesive are prepared; the polyamide acid is coated on the copper foil to prepare the single-sided copper clad laminate; the adhesive is coated between the single-sided copper clad laminate and the copper foil or the other single-sided copper clad laminate and carrying out the lamination to prepare the double-sided flexible copper clad laminate. The performances of size stability, folding resistance, anti-aging property, and the like of the double-sided flexible copper clad laminate are higher than the double-sided copper clad laminate which is produced by a traditional three-layer method, the appearance quality is better than the two-layer double-sided copper clad laminate produced by a lamination method, and the double-sided flexible copper clad laminate simultaneously has the low-cost advantage, thereby facilitating the mass production.

Description

technical field [0001] The invention relates to a double-sided flexible copper-clad laminate and a manufacturing method thereof, in particular to a thinned double-sided flexible copper-clad laminate and a manufacturing method thereof. Background technique [0002] As electronic products become thinner and lighter, circuit substrates are also required to be thinner and lighter. Therefore, rigid circuit boards are developed into flexible circuit boards or rigid-flexible circuit boards. In particular, mobile phones require large screen displays, making flip phones and slider phones popular. In pursuit of connection reliability between the hinge part of the flip cover and the slide cover, it is necessary to make the base material of the circuit thinner, have higher flex resistance, and high dimensional stability. In addition, LCD assembly requires that the terminal block has high dimensional stability and ultra-thin low resilience, and the base material is required to be thinn...

Claims

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Application Information

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IPC IPC(8): H05K1/03H05K3/00H05K3/38
Inventor 伍宏奎杨宏茹敬宏梁立
Owner GUANGDONG SHENGYI SCI TECH
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