Copper-based electric contact material for low-voltage apparatus
A technology of low-voltage electrical appliances and electrical contact materials, applied in the field of material design and preparation technology for copper-based electrical contact materials, can solve the problems of less application, high electrical and thermal conductivity, strength, hardness, etc.
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Embodiment 1
[0012] Example 1 Ni—3%, Zr—0.5%, Y—0.5%, Cu is the balance, and the specific steps are described in detail in the detailed description.
Embodiment 2
[0013] Example 2 Ni—1%, Zr—0.3%, Y—0.2%, Cu is the balance, and the specific steps are described in detail in the detailed description.
Embodiment 3
[0014] Example 3 Ni—0.5%, Zr—0.1%, Y—0.1%, Cu is the balance, and the specific steps are described in detail in the detailed description.
[0015] The organization and performance of the embodiment 2 prepared by the present invention can be seen from its microstructure as attached figure 1 It can be seen from the figure that the second phase exists in the state of particles in the microstructure, the distribution is diffuse and uniform, and there is no obvious segregation. The material density is 8.75g cm -3 , a small amount of voids in the material makes the density of the sample slightly lower than the theoretical density of 8.94g cm -3 ; Conductivity is 29.3Ms m -1 , the corresponding resistivity is 3.41μΩ·cm; hardness is HV105.4. Excellent oxidation resistance and arc ablation resistance, long service life.
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