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Method for preparing metal liquid mixed with granule having high heat-transfer performance

A metal liquid, high heat transfer technology, applied in the direction of heat exchange materials, chemical instruments and methods, etc., can solve the problems of low thermal conductivity, increased demand for heat dissipation of chips, etc., and achieve good performance, wide application range, and cost reduction Effect

Active Publication Date: 2009-04-29
TECHNICAL INST OF PHYSICS & CHEMISTRY - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, as the performance requirements of microprocessors are getting higher and higher, and the integration of microelectronic chips is increasing, the demand for heat dissipation per unit area of ​​chips is increasing. Traditional thermal interface materials with organic polymers as the main body, due to their low The thermal conductivity is far from meeting the needs

Method used

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  • Method for preparing metal liquid mixed with granule having high heat-transfer performance

Examples

Experimental program
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Effect test

Embodiment 1

[0032] 100 mg of single-walled carbon nanotubes, the particle diameter of which is 900 nanometers, is added to 20 ml of mixed acid (volume ratio of 3) of sulfuric acid and nitric acid, and then soaked in 0.1mol / L NaOH solution at 80°C for 10 Minutes, after ultrasonic washing with deionized water, and then with 0.2mol / LNiSO 4 Soak at room temperature for 10 minutes, wash with water, and then use KBH 4 Reduction of Ni adsorbed on nanotubes 2+ , at 0.0024M / LPdCl 2 Activated in the activation solution. The activated nanotubes were thoroughly rinsed with deionized water until the pH was equal to 7, and then added to the pre-prepared solution containing NiSO 4 , NaH 2 PO 4 , Na 3 C 6 h 5 o 7 , NaAc plating solution for electroless nickel plating. The electroless-plated nanoparticles were sonicated for 15 minutes, washed with deionized water until neutral, centrifuged, and vacuum-dried to obtain carbon nanotubes with metal surfaces.

[0033] Blend the surface-modified carb...

Embodiment 2

[0035] According to the preparation method of Example 1, only the liquid metal gallium is replaced by mercury, and the temperature of stirring and ultrasonic dispersion is replaced by room temperature.

Embodiment 3

[0037] According to the preparation method of Example 1, only the liquid metal gallium is replaced by a gallium-indium series alloy (such as 62.5% Ga, 21.5% In, 16% Sn), and the temperature of stirring and ultrasonic dispersion is replaced by room temperature.

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Abstract

The invention relates to a method for preparing a metal liquid mixed with particles which has high heat transferring performance. The method comprises the following steps: a. particles as a solute and liquid metal as a solvent are mixed to form the liquid metal mixed with the particles; the ratio of mass portions of the particles to the liquid metal is between 1 to 0.1 and 1 to 99; and b. the liquid metal mixed with the particles is subjected to mechanical stirring and ultrasonic dispersion in order that the particles in the liquid metal are evenly dispersed, thereby obtaining the metal liquid mixed with the particles. Through the method, the prepared metal liquid mixed with the particles has high thermal conductivity.

Description

technical field [0001] The invention relates to a method for preparing metal liquid mixed with particles with high heat transfer performance, in particular to a method for modifying the surface of high thermal conductivity particles so that they can be better mixed in liquid metal A method of forming a metallic liquid mixed with particles. Background technique [0002] With the rapid development of microelectronics technology, the size of the chip is getting smaller and smaller, and the calculation speed is getting faster and faster, and the heat is getting bigger and bigger. For example, the Intel processor 3.6G Pentium 4 Ultimate Edition generates the most heat when it is running. It can reach 115W, which puts forward higher requirements for the heat dissipation of the chip. Statistics show that the reliability of electronic components decreases by 10% for every 2°C increase in temperature. For a computer, the increase in operating temperature will reduce its operating s...

Claims

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Application Information

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IPC IPC(8): C09K5/12
Inventor 谢开旺刘静
Owner TECHNICAL INST OF PHYSICS & CHEMISTRY - CHINESE ACAD OF SCI
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