Vacuum multifunctional continuous film coating apparatus

Abstract

The invention belongs to the technical field of electronic mechanical technology and relates to a high-vacuum multifunctional ion beam sputtering and electron beam evaporation continuous film plating device. A vacuum film plating chamber of the device has a single chamber structure; a generator of an ion beam sputtering source and a generator of an electron beam evaporation plating source are arranged outside the vacuum film plating chamber; inlets of two generators conducting to the vacuum film plating chamber are correspondingly provided with an ion beam sputtering source baffle plate and an electron beam evaporation plating source baffle plate; constant tensile force can reverse a furling and stretching reel of a winding unit, follow a transition shaft and is fixed on a connecting and supporting device of the vacuum film plating chamber; and corresponding sensing, driving and controlling are arranged outside the vacuum film plating chamber. The device has a compact structure, various film plating and continuous film plating functions in the single vacuum chamber, can realize the auxiliary enhanced deposition of ion beams in the discontinuous or full film plating process, can improve the utilization rate of a sputtering target material by 60 to 100 percent, in particular a noble metal target material and a class of a target material which is difficult to machine, and can also obtain a coating-type composite film product with special functions through an inlaid-type target.

Description

technical field [0001] The invention belongs to the technical field of electromechanics, in particular to a high-vacuum multifunctional ion beam sputtering and electron beam evaporation continuous coating device. Background technique [0002] Composite film products plated on substrates such as flexible polymer and carbonaceous material strips, thin metal strips, etc., are widely used in modern industry and high-tech fields. For example, magnetic composite films widely used in the fields of electronic communication, network devices, and electromagnetic interference prevention (MEI) require dense plating of 2 to 8 layers of Fe, Fe, Ni, Zr, Cr, Co, Hf, Mo, Td, Si, B, etc. and their compound films, the composition and thickness deviation of the single-layer film is less than 5%; another example: the carrier catalyst commonly used in hydrogen energy utilization is usually In a high vacuum environment, a rare metal alloy catalyst composite film is plated on a strip of carbonaceo...

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Problems solved by technology

[0003] First of all, the processing of these multi-layer film or composite film products generally requires the use of various technologies such as ion beam sputtering, magnetron sputtering, and electron beam evaporation coating in a high-vacuum environment. At present, various coating devices are used to coat them separately or multiple vacuum chambers to complete the coating in sequence, there are the following defects: 1. For the separate coating methods of multiple coating devices, when the device is changed, the intermediate product is frequently exposed to the atmospheric environment, which destroys the quality of the intermediate film layer. At the same time, the frequent pumping and temperature rise and fall process lengthens the process flow and reduces the processing efficiency; 2. For the way of multi-vacuum chamber connection device, since multiple vacuum chambers are set, it is necessary to set up pumping in multiple vacuum chambers. , gas circuit, detection, heating and baking, electric control and other units, the manufacturing cost is high, and the utilization rate of the vacuum chamber volume is also reduced

However, due to the high energy density of the focused beam spot of the ion beam, it is difficult to accurately control the ion / atom arrival ratio of the mosaic target, which affects the composition and structure control of the composite film; the sputtering of the fixed part of the target by the focused beam spot of the ion beam, It will shorten the service life of the target and reduce the utilization rate of the target, especially for precious metal targets and difficult-to-process targets, which will greatly increase the production cost of multi-layer film or composite film products

However, the currently disclosed "sputtering target", such as the patent No. 99243973.6, uses a sputtering target with a curved cross-sectional shape, which can increase the utilization rate of the target by 40-80%, but with the change of the target composition, The actual consumption curve of the target will also change significantly, making the processing technology of the curved sputtering target more complex and increasing the processing difficulty and cost

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