Integrated preparation method for integrated circuit and capacitance type micro-silicon microphone single slice as well as chip

Abstract

The invention provides a monolithically integrated manufacturing method and a chip for an integrated circuit and a capacitor type micro-silicon microphone. The method comprises the following steps: firstly, a substrate with a first area and a second area is provided; secondly, according to the standard semiconductor technique flow, the integrated circuit with a grid conductive layer is manufactured on the first area, the grid conductive layer and a medium insulating layer covered on the grid conductive layer extend to the second area; and thirdly, the medium insulating layer on the second area is removed, and a first membrane layer, a sacrificial layer and a second membrane layer are generated in sequence on the exposed grid conductive layer by the low temperature technique below 400 DEG C, and then the sacrificial layer with the eroded part forms the capacitor type micro-silicon microphone, the exposed grid conductive layer and the first membrane layer are taken as one electrode of the capacitor, and the second membrane layer is taken as the other electrode of the capacitor, thereby realizing the monolithic integration of the integrated circuit and the capacitor type micro-silicon microphone.

Description

technical field [0001] The invention relates to a manufacturing method for monolithic integration of an integrated circuit and a capacitive microsilicon microphone and a monolithic integrated chip formed by the manufacturing method. Background technique [0002] A microphone is a transducer that converts sound signals into electrical signals. The basic structure of a condenser microphone includes a sensitive film as one pole of the capacitor and a back plate as the other pole of the capacitor. When a sound signal acts on the microphone, the sound pressure causes the sensitive film to deform, which in turn causes a gap between the sensitive film and the back plate. The capacitance changes, and this capacitance change can be converted into an electrical signal by the subsequent processing circuit. [0003] Since Bell Labs scientists invented the electret condenser microphone (ECM) in 1962, after decades of development, ECM has been widely used in various fields. However, the...

AI Technical Summary

Problems solved by technology

The disadvantage of the third integration method is that after the IC is completed, in order not to affect the performance of the IC, there must be no high-temperature process in the subsequent MEMS device manufacturing process, because after the IC manufacturing process is completed, metals such as aluminum used as metal electrodes cannot withstand 400 ° C above high temperature

Images