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Cleaning-free scaling powder for tin-silver-zinc series lead-free solder

A technology of lead-free solder and flux, applied in the direction of welding/cutting media/materials, welding media, welding equipment, etc., can solve problems such as moisture absorption, impact, poor mechanical and electrical properties of the workpiece, and achieve cost reduction and surface Effects of smoothness, wettability improvement and anti-oxidation ability

Inactive Publication Date: 2008-12-24
太仓市南仓金属材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Chinese invention patent 200410026717.X records a no-clean lead-free solder flux, but because the flux mainly adopts rosin-like modified resin, and rosin is corrosive, the residue on the surface of the workpiece will cause moisture absorption, This has adverse effects on the mechanical and electrical properties of the workpiece after welding

Method used

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  • Cleaning-free scaling powder for tin-silver-zinc series lead-free solder
  • Cleaning-free scaling powder for tin-silver-zinc series lead-free solder

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] The no-cleaning flux for tin-silver-zinc lead-free solder according to the present embodiment consists of the following components in parts by weight:

[0023] Adipic acid 8

[0024] Glycerin 10

[0025] Ethylene glycol methyl ether 5

[0026] Hydrogenated castor oil 1

[0027] Benzimidazole 0.1

[0028] Polyphenolic resin 1.4

[0029] Deionized water 74.5

[0030] The preparation process of the flux of this example is:

[0031] At room temperature, add 50 parts of deionized water and 5 parts of ethylene glycol methyl ether into a reaction kettle with a stirrer, add 1 part of hydrogenated castor oil and 1.4 parts of polyphenolic resin under stirring, and after dissolving, add 24.5 parts Deionized water and 10 parts of glycerin, then add 0.1 part of benzimidazole, and stir until the solids are completely dissolved. After the materials are evenly mixed, stand and filter to remove impurities mixed therein, and retain the filtrate to become the no-cleaning flux of the...

Embodiment 2

[0033] The no-cleaning flux for tin-silver-zinc lead-free solder according to the present embodiment consists of the following components in parts by weight:

[0034] Glyceric acid 12

[0035] Glycerin 15

[0036] Hydrogenated castor oil 2

[0037] Benzimidazole 0.3

[0038] Modified Cellulose 1.2

[0039] Deionized water 69.5

[0040] Its preparation is with embodiment 1.

Embodiment 3

[0042] The no-cleaning flux for tin-silver-zinc lead-free solder according to the present embodiment consists of the following components in parts by weight:

[0043] Acetic acid 2

[0044] Lactic acid 8

[0045] Glycerin 5

[0046] Hexylene glycol 8

[0047] Hydrogenated castor oil 3

[0048] Mebenzimidazole 1

[0049] Modified Cellulose 2

[0050] Deionized water 71

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Abstract

The present invention relates to a wash-free soldering flux used by Sn-Ag-Zn leadless solder. Based on the total weight of the soldering flux, the ingredients of the soldering flux include 0.1 percent to 15 percent of activating agent, 0.1 percent to 15 percent of wetting agent, 0.1 percent to 5 percent of thixotropic agent, 0.1 percent to 2 percent of corrosion inhibitor and 0.1 percent to 5 percent of oxidation inhibitor, and the rest is deionized water. The non-corrosive soldering flux can be perfectly cooperated with the Sn-Ag-Zn leadless solder and adapted to the soldering temperature requirement of the leadless solder and can increase the wetting property and the inhibiting ability of the leadless solder and enhance the solderability of the leadless solder, a small quantity of residues are left, washing is not needed, soldering spots can have good quality, bright and clean surfaces and strong stability, and a dried circuit board can have a large insulation resistance value. In addition, the soldering flux is environment-friendly and produces no pollution, moreover, a washing process can be omitted, and the cost is reduced.

Description

technical field [0001] The invention belongs to the technical field of lead-free solder, in particular to a no-cleaning flux suitable for tin-silver-zinc lead-free solder. Background technique [0002] Various electronic products that are closely related to human life and work benefit human beings, but also increasingly endanger human health and the ecological environment due to the use of lead-containing solder in electronic products. Waste of Electrical and Electronic Equipment (WEEE), led by the European Union, called for an end to the use of lead-containing materials in the electronics assembly industry in 2006. The National Electronics Manufacturing Institute (NEMI) of the United States has implemented a special project called "NEMI's Soldering Lead-Free Program" to systematically study the use of lead-free assembly in the electronics industry; Japan's major consumer electronics manufacturers have also promised to fully implement it as soon as possible. To realize lead...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/363
Inventor 王文忠刘永长韦晨余黎明徐荣雷
Owner 太仓市南仓金属材料有限公司
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