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Preparation of insulated heat conducting metal substrate

A metal substrate, insulating and thermally conductive technology, which is applied in the field of preparation of insulating and thermally conductive metal substrates

Inactive Publication Date: 2010-06-30
MITAC PRECISION TECH(KUNSHAN) CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] At present, there is no method in the market to prepare insulating and heat-conducting metal substrates by using the novel thin film coating technology of Plasma Chemical Vapor Deposition (PCVD)

Method used

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Examples

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Embodiment Construction

[0012] The preparation method of the insulating and heat-conducting metal substrate of the present invention comprises the following steps:

[0013] 1 Provide a metal substrate and place the metal substrate in a plasma reaction chamber (the plasma reaction chamber can be a batch or continuous (in-line) chemical vapor deposition reactor), when the metal substrate is placed in the plasma , the surface of the metal substrate will carry a negative voltage of 20~30volts. Wherein, the surface of the metal substrate is in any shape and any surface state such as strip, plane, curved surface or three-dimensional. The material of the metal substrate is one of metals such as copper alloy, stainless steel, Ni-Ti alloy, magnesium alloy or aluminum alloy. In addition, the metal substrate needs to be pre-treated, and the pre-treatment includes degreasing, pickling, cleaning and other steps to clean the surface of the metal substrate.

[0014] 2 Plasma pretreatment

[0015] Will be mixed w...

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Abstract

The invention provides a preparation method of an insulating and heat-conducting metallic substrate, which comprises the following steps: a metallic parent material is provided and placed in a plasma reaction chamber; a gas mixture with mixed high-erosiveness gas is let into the plasma reaction chamber, and the surface of the metallic parent material is eroded irregularly; the chemical vapor deposition of plasmas is implemented in the plasma reaction chamber, free radical plasmas are generated, and multiple highly heat-conducting coatings are formed on the surface of the metallic parent material. The preparation method of the insulating and heat-conducting metallic substrate can implement even plating on any metallic substrates with any surface state.

Description

【Technical field】 [0001] The invention relates to a method for preparing an insulating and heat-conducting metal substrate, in particular to a method for preparing an insulating and heat-conducting metal substrate that can uniformly coat metal substrates in any surface state. 【Background technique】 [0002] A good insulating and thermally conductive substrate must have high thermal conductivity, insulation, and low expansion coefficient. [0003] One of the traditional preparation methods of insulating and thermally conductive substrates is to print copper foil circuits on plastic substrates such as FR4 printed circuit substrates (PCBs), whose thermal conductivity (K) is about 0.36W / m·K, and its disadvantage is poor thermal performance. [0004] The second method of preparing the insulating and heat-conducting substrate is to attach a metal plate such as an aluminum substrate to the PCB substrate, which is the so-called Metal Core PCB substrate, to improve heat dissipation e...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C28/00C23C16/513C23C16/02C23F4/00C23C16/448
Inventor 吴政道胡振宇郭雪梅
Owner MITAC PRECISION TECH(KUNSHAN) CORP
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