Low temperature deposition method of hypovanadic oxide thin film on glass
A technology of vanadium dioxide and deposition method, which is applied in the direction of ion implantation plating, metal material coating process, coating, etc., can solve the research that started as early as the early 1970s, obstacles to the industrialization of smart glass, Increase the difficulty of industrialization and other issues to achieve the effects of reducing difficulty, saving energy consumption, and low crystallization temperature
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Embodiment 1
[0021] Multilayer thin films were prepared by magnetron sputtering. The magnetron sputtering system consists of a transition chamber and a main sputtering chamber (45 cm in diameter). The main sputtering chamber is connected with a molecular diffusion pump, and the ultimate vacuum is 2.0×10 -6 Pa. The sputtering chamber has three target positions for three different 2-inch diameter targets. Each target position is inclined upward at an angle of 30°, and can be co-sputtered upwards in a confocal manner or sputtered upwards in a three-target independent manner. The sample stage can be heated up to over 600°C and can keep rotating continuously during the sputtering process.
[0022] In the experiment, the substrate was float glass. The substrate was ultrasonically cleaned in anhydrous alcohol and acetone for 5 minutes, then dried with nitrogen, fixed on the sample stage and placed in a transitional vacuum chamber for vacuuming. After 10 minutes, transfer to the sputtering va...
Embodiment 2
[0028] The vacuum deposition system and substrate cleaning and installation process are the same as those in Embodiment 1. Before thin film sputtering, the float glass substrate was heated to 350 °C and kept constant.
[0029] Preparation of Diffusion Barrier Silica. Silicon is used as the cathode sputtering material, radio frequency sputtering, and the sputtering power is set to 100W. When the sputtering chamber is fed with Ar gas, it is also fed with O 2 Gas (purity higher than 99.9%), the flow velocity of Ar gas is 30sccm, O 2 The gas flow rate was 7.5 sccm. Sputtering for 20 min, deposited SiO 2 The thickness of the film layer is about 60nm.
[0030] Preparation of metal oxide buffer layers. The preparation conditions are as follows: use a tin oxide ceramic target material, the working atmosphere is high-purity Ar gas (purity: 99.9995%), inject it into the sputtering chamber at a flow rate of 30 sccm and keep the working pressure of the sputtering chamber at 0.6Pa; ...
Embodiment 3
[0034] The vacuum deposition system and substrate cleaning and installation process are the same as those in Embodiment 1.
[0035] Before thin film sputtering, the float glass substrate was heated to 280 °C and kept constant.
[0036] The preparation of silicon dioxide as a diffusion barrier layer is the same as in Example 1. Sputtering for 85 minutes, deposited SiO 2 The thickness of the film layer is about 50nm.
[0037] Preparation of metal oxide buffer layers. The preparation conditions are as follows: use an indium oxide ceramic target material, the working atmosphere is high-purity Ar gas (purity: 99.9995%), inject it into the sputtering chamber at a flow rate of 30 sccm and keep the working pressure of the sputtering chamber at 0.6Pa; Set to 50W and sputter for 10 minutes. At this time, the In deposited on the glass substrate 2 o 3 The film thickness is about 30nm.
[0038] Preparation of vanadium dioxide by thermochromatography. Adopt vanadium dioxide to make ...
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