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Monodisperse high-performance conductive silver particle

A monodisperse and monodisperse technology, applied in liquid chemical plating, coating, metal material coating process, etc., can solve the problems of high price, electromigration, insufficient particle uniformity, etc., and achieve the effect of low cost

Inactive Publication Date: 2008-08-20
镇江爱邦电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the wide particle size distribution of the above ultrafine metal powders and different particle shapes, and the high resistance of nickel powder and copper powder, silver powder will produce electromigration under the action of an electric field, and the price is relatively expensive, so the production of zebra paper The cost is high, and the uniformity of the particles is not enough

Method used

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  • Monodisperse high-performance conductive silver particle
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  • Monodisperse high-performance conductive silver particle

Examples

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Effect test

example 1

[0038] Add 1 gram of crystal nucleus particles into 30 ml of sodium dodecyl sulfonate aqueous solution, and ultrasonically disperse it into emulsion a. Put 2 g of chlorododecane into 30 ml of sodium dodecyl sulfonate aqueous solution, and disperse it into emulsion a by ultrasonic For emulsion b, emulsion a and emulsion b were mixed and stirred at 35° C. for 5 hours to obtain emulsion c.

[0039] Dissolve 0.1 g of benzoyl peroxide in 9 g of styrene and 1 g of divinylbenzene, then ultrasonically disperse it in 50 ml of sodium dodecylsulfonate aqueous solution to form emulsion d, mix emulsion c and emulsion d, and heat at 35°C Under stirring for 12 hours, emulsion e was obtained.

[0040] Add polyvinyl alcohol solution to emulsion e to obtain emulsion f. Heat the emulsion f to 70°C for 12 hours to obtain monodisperse microspheres with a certain particle size.

[0041] The obtained polymer microsphere electron micrograph is shown in the attached figure 2 .

[0042] It can be ...

example 2

[0044] Add 1 gram of crystal nucleus particles into 30 ml of sodium dodecyl sulfonate aqueous solution, and ultrasonically disperse it into emulsion a. Put 2 g of chlorododecane into 30 ml of sodium dodecyl sulfonate aqueous solution, and disperse it into emulsion a by ultrasonic For emulsion b, emulsion a and emulsion b were mixed and stirred at 35° C. for 5 hours to obtain emulsion c.

[0045]Dissolve 0.15 g of benzoyl peroxide in 12 g of styrene and 3 g of divinylbenzene, then ultrasonically disperse in 80 ml of sodium dodecylsulfonate aqueous solution to form emulsion d, mix emulsion c and emulsion d, and heat at 35°C Under stirring for 12 hours, emulsion e was obtained.

[0046] Add polyvinyl alcohol solution to emulsion e to obtain emulsion f. Heat the emulsion f to 70°C for 12 hours to obtain monodisperse microspheres with a certain particle size.

[0047] The obtained polymer microsphere electron micrograph is shown in the attached image 3 .

[0048] It can be see...

example 3

[0050] Add 1 gram of crystal nucleus particles into 30 ml of sodium dodecyl sulfonate aqueous solution, and ultrasonically disperse it into emulsion a, put 2 g of chlorododecane into 30 ml of sodium dodecyl sulfonate aqueous solution, and disperse into emulsion a by ultrasonic For emulsion b, emulsion a and emulsion b were mixed and stirred at 35° C. for 5 hours to obtain emulsion c.

[0051] Dissolve 0.25 g of benzoyl peroxide in 20 g of styrene and 5 g of divinylbenzene, then ultrasonically disperse in 150 ml of sodium dodecylsulfonate aqueous solution to form emulsion d, mix emulsion c and emulsion d, and heat at 35°C Under stirring for 12 hours, emulsion e was obtained.

[0052] Add polyvinyl alcohol solution to emulsion e to obtain emulsion f. Heat the emulsion f to 70°C for 12 hours to obtain monodisperse microspheres with a certain particle size.

[0053] The obtained polymer microsphere electron micrograph is shown in the attached Figure 4 .

[0054] It can be see...

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Abstract

The invention relates to a high performance conductive silver particle for fine pitch connection. The conductive particle takes mono-disperse resin particle as the matrix and adheres with nickel and silver layers on the surface, which leads the particle to have good conductivity. By dispersing the conductive particle in bonding materials, an anisotropic conductive adhesive can be obtained. The adhesive can be used in the fine pitch connection of cable wiring on distribution frame, and is mainly used for replacing conductive nickel powder with the advantage of extremely high reliability of conductivity.

Description

technical field [0001] The invention relates to a high-performance conductive silver particle for fine-pitch connection. Background technique [0002] With the rise of high-density wiring technology, gold, silver, copper, and nickel metal powders with low resistivity have been used as anisotropic conductive fillers for fine-pitch connections, followed by silver, copper, and nickel as the core , gold-plated conductive particles on the surface. The conductive filler is mainly dispersed in the matrix in a spherical or irregular shape, forming an anisotropic circuit conduction. Commonly used fillers are mostly metal powders such as gold, silver, copper, and nickel with low resistivity. Gold powder has the best resistivity, but it is expensive. [0003] So far, in the civilian low-end field, fine-pitch connections (such as zebra paper) that are not very demanding on the process generally use relatively cheap ultra-fine nickel powder or copper powder or use relatively high-price...

Claims

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Application Information

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IPC IPC(8): C08J3/12C08J7/04C08L25/06C08L33/12C08F2/44C23C18/28C23C18/36
Inventor 周际东麻亮潘俊晶
Owner 镇江爱邦电子科技有限公司
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